LAN8700IC-AEZG-TR Standard Microsystems (SMSC), LAN8700IC-AEZG-TR Datasheet - Page 65

• Manufacturer Part Number: LAN8700IC-AEZG-TR
• Manufacturer: Standard Microsystems (SMSC)

Specifications of LAN8700IC-AEZG-TR

• Number Of Receivers: 1
• Data Rate: 10/100Mbps
• Operating Supply Voltage (typ): 3.3V
• Package Type: QFN EP
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Lead Free Status / RoHS Status: Compliant

±15kV ESD Protected MII/RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support and flexPWR
Datasheet
Chapter 7 DC Electrical Characteristics
SMSC LAN8700/LAN8700i
7.1
7.1.1
7.1.1.1
VDD33,VDDIO
Digital IO
VSS
Operating
Temperature
Operating
Temperature
Storage
Temperature
All Pins
System
System
All Pins
PARAMETER
PARAMETER
Maximum Guaranteed Ratings
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing, and is done without power applied to the IC. To pass the test, the device must have
no change in operation or performance due to the event. All pins on the LAN8700 provide ±8kV HBM
protection.
DC Characteristics
Human Body Model
EN/IEC61000-4-2 Contact
Discharge
EN/IEC61000-4-2 Air-gap
Discharge
EIA/JESD 78, Class II
Power pins to all other pins.
To VSS ground
VSS to all other pins
LAN8700-AEZG
LAN8700i-AEZG
CONDITIONS
CONDITIONS
Table 7.2 ESD and LATCH-UP Performance
Table 7.1 Maximum Conditions
LATCH-UP PERFORMANCE
ESD PERFORMANCE
DATASHEET
-0.5
-40
-0.5
-0.5
0
-55
MIN
®
MIN
65
Technology in a Small Footprint
TYP
150
TYP
+3.6
+3.6
+4.0
+70
+85
+150
MAX
±8
±8
±15
MAX
V
V
V
C
C
C
UNITS
kV
kV
kV
mA
UNITS
Table 7.5, “MII Bus
Interface Signals,” on
page 68
Commercial temperature
components.
Industrial temperature
components.
Device
3rd party system test
3rd party system test
Revision 2.2 (12-04-09)
COMMENT
COMMENTS