CPC7594MB IXYS, CPC7594MB Datasheet - Page 19

• Manufacturer Part Number: CPC7594MB
• Manufacturer: IXYS

Specifications of CPC7594MB

• Lead Free Status / RoHS Status: Supplier Unconfirmed

3.2 Printed-Circuit Board Layout
NOTE: For optimum solder joint size, MLP package
printed-circuit board pads should extend no more than
0.05 mm past the chip post on the short sides, and no
more than 0.025 mm past the chip posts on the long
sides.
As the metallic pad on the bottom of the MLP package
is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to maintain minimum
creepage and clearance values.
R01.1
6.65
(0.047)
1.193
1.10
3.2.1 SOIC
3.2.2 MLP
0.73
(0.031)
Detail A
PC Board Pattern
0.787
0.70
0.45
(Top View)
(0.050)
1.270
Detail A
1.10
0.45
6.05
5.60
All dimensions in mm
(0.383 ± 0.002)
Not drawn to scale
5.45 on center
9.728 ± 0.051
DIMENSIONS
INCHES
(MM)
0.80 on center
www.clare.com
CPC7594
19