BP100-0.005-00-1112 Bergquist, BP100-0.005-00-1112 Datasheet - Page 22

• Manufacturer Part Number: BP100-0.005-00-1112
• Description: THERMAL TAPE DOUBLE SIDED .005"
• Manufacturer: Bergquist
• Series: Bond-Ply® 100r

Specifications of BP100-0.005-00-1112

• Usage: Sheet
• Shape: Rectangular
• Outline: 304.80mm x 279.40mm
• Thickness: 0.005" (0.127mm)
• Adhesive: Adhesive - Both Sides
• Backing, Carrier: Fiberglass
• Color: White
• Thermal Resistivity: 0.52°C/W
• Thermal Conductivity: 0.8 W/m-K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BER246; BG410824; BG426657; BOND PLY 105 11X12"

20
Solutions For Surface-Mount Applications
Thermal Clad
Intel Core
Phenom
Hi-Flow
The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface
for many surface mount packages. At the phase change temperature, Hi-Flow materials
change from a solid and flow with minimal applied pressure.This characteristic optimizes
heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to
replace messy thermal grease.
Bergquist phase change materials are specially compounded to prevent pump-out of
the interface area, which is often associated with thermal grease.Typical applications for
Hi-Flow materials include:
• Intel Core
• DC/DC converters
• Power modules
Hi-Flow materials are manufactured with or without film or foil carriers.
Custom shapes and sizes for non-standard applications are also available.
Sil-Pad
Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad family of materials
are thermally conductive and electrically insulating. Available in custom shapes, sheets,
and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in
SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages
Sil-Pad or
Bond-Ply
Power Device
Power Device
Processor
TM
TM
and Athlon
and Pentium
®
Mid Power Application with Bond-Ply or Sil-Pad
TM
®
Series, Pentium
®
are registered trademarks of Advanced Micro Devices, Inc.
®
are registered trademarks of Intel Corporation.
Hi-Flow without Thermal Clad
Hi-Flow with Thermal Clad
High Power Application
High Power Application
®
, Phenom
TM
, Athlon
®
, and other high performance CPUs
Hi-Flow
FR-4
Hi-Flow
Heat
Spreader
Heat
Spreader
FR-4 Board
Heat
Spreader