BP100-0.005-00-1112 Bergquist, BP100-0.005-00-1112 Datasheet - Page 16
![THERMAL TAPE DOUBLE SIDED .005"](/photos/5/96/59608/bond_ply_108_10x10_sml.jpg)
BP100-0.005-00-1112
Manufacturer Part Number
BP100-0.005-00-1112
Description
THERMAL TAPE DOUBLE SIDED .005"
Manufacturer
Bergquist
Series
Bond-Ply® 100r
Specifications of BP100-0.005-00-1112
Usage
Sheet
Shape
Rectangular
Outline
304.80mm x 279.40mm
Thickness
0.005" (0.127mm)
Adhesive
Adhesive - Both Sides
Backing, Carrier
Fiberglass
Color
White
Thermal Resistivity
0.52°C/W
Thermal Conductivity
0.8 W/m-K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BER246
BG410824
BG426657
BOND PLY 105 11X12"
BG410824
BG426657
BOND PLY 105 11X12"
14
Selecting A Circuit Layer
t
t
t
Current Carrying Capabilities
The circuit layer is the component-mounting layer in Thermal Clad.
Current carrying capability is a key consideration because this layer
typically serves as a printed circuit, interconnecting the components of
the assembly. The advantage of Thermal Clad is that the circuit trace
interconnecting components can carry higher currents because of its
ability to dissipate heat due to I
Temperature rise comparison graph depicts the significant difference between Bergquist
Dielectric HT and FR-4. Additional comparison charts regarding all Bergquist Dielectrics are
available. Note: No base metal used in calculation.
Current Carrying Capabilities
Heat Spreading Capabilities
Flatness In Relationship To Thickness
10
9
8
7
6
5
4
3
2
1
1" by 0.125" ( 25mm by 3.2mm) trace
or 0.006" (152 µm) FR-4 dielectric
on 0.003" (76 µm) HT dielectric
5
10
2
R loss in the copper circuitry.
15
20
HT
1 oz (35
2 oz (70
1 oz (35
2 oz (70
25
µm)
µm)
µm)
µm)
Temperature rise comparison graph depicts the significant difference between Bergquist
Dielectric HT and FR-4. Additional comparison charts regarding all Bergquist Dielectrics are
available. Note: No base metal used in calculation.
Want a cost effective,
optimized circuit design?
This Thermal Clad White Paper addresses specific design
recommendations including mechanical, circuit, soldermask,
fabrication and test options to help optimize your design.
50
40
30
20
10
0
0
50
1" by 0.125" ( 25mm by 3.2mm) trace
or 0.006" (152 µm) FR-4 dielectric
on 0.003" (76 µm) HT dielectric
100
150
200
HT
1 oz (35
3 oz (105
6 oz (210
10 oz (350
1 oz (35
3 oz (105
6 oz (210
10 oz (350
250
µm)
µm)
µm)
µm)
µm)
µm)
µm)
µm)