SP900S-0.009-00-54 Bergquist, SP900S-0.009-00-54 Datasheet - Page 3

• Manufacturer Part Number: SP900S-0.009-00-54
• Description: THERMAL PAD TO-220 .009" SP900
• Manufacturer: Bergquist
• Series: Sil-Pad® 900-Sr

Specifications of SP900S-0.009-00-54

• Usage: TO-220
• Shape: Rectangular
• Outline: 19.05mm x 12.70mm
• Thickness: 0.009" (0.229mm)
• Backing, Carrier: Fiberglass
• Color: Pink
• Thermal Resistivity: 0.61°C/W
• Thermal Conductivity: 1.6 W/m-K
• Packages Cooled: TO-220 / TO-247 / TO-218
• Operating Temperature Range: -60°C To +180°C
• Svhc: No SVHC (18-Jun-2010)
• Breakdown Voltage Vbr: 5.5V
• Colour: Mauve
• Dielectric Constant: 6
• External Depth: 0.2mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: BER175; SP900-54; SP900S-54

Thermal Clad
Dielectrics
Design Considerations
Other Bergquist Thermal Products
Appendix
Thermal Clad Configurations
Thermal Clad Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-3
Thermal Clad Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Thermal Clad Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Selecting Dielectric Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-7
Dielectric Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Summary Of Key Dielectric Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Using Dielectric Materials In Specialty Applications . . . . . . . . . . . . . . . . . . . . . . . .10-11
Selecting The Base Metal Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-13
Selecting A Circuit Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-15
Electrical Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-17
Assembly Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18-19
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Table of Contents
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