SP900S-0.009-00-54 Bergquist, SP900S-0.009-00-54 Datasheet - Page 22

• Manufacturer Part Number: SP900S-0.009-00-54
• Description: THERMAL PAD TO-220 .009" SP900
• Manufacturer: Bergquist
• Series: Sil-Pad® 900-Sr

Specifications of SP900S-0.009-00-54

• Usage: TO-220
• Shape: Rectangular
• Outline: 19.05mm x 12.70mm
• Thickness: 0.009" (0.229mm)
• Backing, Carrier: Fiberglass
• Color: Pink
• Thermal Resistivity: 0.61°C/W
• Thermal Conductivity: 1.6 W/m-K
• Packages Cooled: TO-220 / TO-247 / TO-218
• Operating Temperature Range: -60°C To +180°C
• Svhc: No SVHC (18-Jun-2010)
• Breakdown Voltage Vbr: 5.5V
• Colour: Mauve
• Dielectric Constant: 6
• External Depth: 0.2mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Adhesive: -
• Other names: BER175; SP900-54; SP900S-54

20
Solutions For Surface-Mount Applications
Thermal Clad
Intel Core
Phenom
Hi-Flow
The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface
for many surface mount packages. At the phase change temperature, Hi-Flow materials
change from a solid and flow with minimal applied pressure.This characteristic optimizes
heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to
replace messy thermal grease.
Bergquist phase change materials are specially compounded to prevent pump-out of
the interface area, which is often associated with thermal grease.Typical applications for
Hi-Flow materials include:
• Intel Core
• DC/DC converters
• Power modules
Hi-Flow materials are manufactured with or without film or foil carriers.
Custom shapes and sizes for non-standard applications are also available.
Sil-Pad
Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad family of materials
are thermally conductive and electrically insulating. Available in custom shapes, sheets,
and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in
SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages
Sil-Pad or
Bond-Ply
Power Device
Power Device
Processor
TM
TM
and Athlon
and Pentium
®
Mid Power Application with Bond-Ply or Sil-Pad
TM
®
Series, Pentium
®
are registered trademarks of Advanced Micro Devices, Inc.
®
are registered trademarks of Intel Corporation.
Hi-Flow without Thermal Clad
Hi-Flow with Thermal Clad
High Power Application
High Power Application
®
, Phenom
TM
, Athlon
®
, and other high performance CPUs
Hi-Flow
FR-4
Hi-Flow
Heat
Spreader
Heat
Spreader
FR-4 Board
Heat
Spreader