655-53AB Wakefield Thermal Solutions, 655-53AB Datasheet - Page 3

• Manufacturer Part Number: 655-53AB
• Description: HEATSINK CPU 40.6MM SQ H=.525"
• Manufacturer: Wakefield Thermal Solutions
• Series: 655r

Specifications of 655-53AB

• Height: 0.52" (13.21mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 40.64mm x 40.64mm
• Power Dissipation @ Temperature Rise: 4W @ 40°C
• Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
• Packages Cooled: BGA / LED
• Width: 40.6mm
• Heat Sink Material: Aluminum
• Length: 40.6mm
• Mounting Type: Adhesive
• Color: Black
• Size: 0.525H X 1.600W X 1.600L"
• Package / Case: BGA
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 40.6 mm L x 40.6 mm W x 13.3 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1093; 65553AB

All other products, please contact factory for price, delivery, and minimums.
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
MECHANICAL DIMENSIONS
P E N G U IN
1
Integrated Circuit
Heat Sinks
660 SERIES
Standard
P/N
660-29AB
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74–76.
642 SERIES
Standard
P/N
642-25AB
642-35AB
642-45AB
642-60AB
Material: Aluminum, Black Anodized
The 642 Series is an unidirectional pin fin heat sink for both natural and
forced-convection applications.
Applications include network routers and switches, high-resolution printers,
digital cameras, consumer video games, digital video disks (DVD) and glob-
al positioning systems (GPS).
™
COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs
Unidirectional Fin Heat Sink for PowerPC™ 603
Unidirectional Fin Heat Sink for BGAs
Base Dimensions
642 SERIES
1.378 (35)
1.378 (35)
1.378 (35)
1.378 (35)
in. Sq.
1.529 (38.8) x 1.530 (38.9)
Base Dimensions
in. (mm)
Fin Height "A"
.450 (11.4)
.600 (15.2)
.250 (6.6)
.350 (8.9)
in. (mm)
28
PRODUCT DESIGNATION
0.285 (7.2)
in. (mm)
Height
PRODUCT FEATURES
•
•
•
Applications
35 mm BGA
35 mm BGA
35 mm BGA
35 mm BGA
Available in four standard heights, .25 inch, .35 inch, .45 inch, and .60 inch.
Available with pressure sensitive adhesives for quick and easy mounting.
Use T4 when attaching to a plastic device surface and T2 for all other
surfaces.
Pages 74–76.
Typical
CONVECTION CHARACTERISTICS
642 THERMAL PERFORMANCE
NATURAL AND FORCED
Black Anodized
Heat Sink
Finish
Pages 74–76
Pages 74–76
Pages 74–76
Pages 74–76
Adhesive
Options
32 mm, 40 mm C4QFP
Normally stocked
0.031 (14.17)
lbs. (grams)
lbs. (grams)
.027 (12.26)
.031 (14.07)
.039 (17.71)
.022 (9.99)
Weight
Weight
BGA