218-40CT5 Wakefield Thermal Solutions, 218-40CT5 Datasheet - Page 8
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218-40CT5
Manufacturer Part Number
218-40CT5
Description
HEATSINK ALUM NATURAL SMD
Manufacturer
Wakefield Thermal Solutions
Series
218r
Specifications of 218-40CT5
Height
0.4" (10.16mm)
Package Cooled
SMD
Attachment Method
SMD Pad
Outline
26.16mm x 12.70mm
Power Dissipation @ Temperature Rise
2W @ 52°C
Thermal Resistance @ Forced Air Flow
21°C/W @ 200 LFM
Thermal Resistance @ Natural
31°C/W
Packages Cooled
TO-218 / TO-220
Thermal Resistance
31°C/W
Width
26.2mm
Heat Sink Material
Copper
Mounting Type
PC Board Surface Mount
Length
12.7mm
Body Plating
Matte Tin
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
26.16 mm L x 12.7 mm W x 10.16 mm H
Designed For
SMT Devices
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
21840CT5
345-1083
345-1083
WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Material: Aluminum,
Black Anodized
MECHANICAL DIMENSIONS
6/14/07
240-118ABH-22
273-AB
274 SERIES
281 SERIES
10:55 AM
Standard
P/N
273-AB
273-ABE-01
273-ABE-02
Material: Aluminum, Black Anodized
Standard
P/N
274-1AB
274-1ABE-01
274-1ABE-02
274-2AB
274-2ABE-01
274-2ABE-02
274-3AB
274-3ABE-01
274-3ABE-02
281-1AB
281-2AB
Standard
P/N
240-118ABEH-22 1.180 (30.0)
240-118ABES-22 1.180 (30.0)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
274 & 281 SERIES
273 SERIES
240 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
240-118ABS-22
Page 29
Height Above
Height Above
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
.375 (9.5)
.375 (9.5)
.375 (9.5)
PC Board
PC Board
in. (mm)
in. (mm)
Height Above
PC Board
in. (mm)
Low-Cost, Low-Height Wavesolderable Heat Sinks
Labor-Saving Twisted Fin Heat Sinks
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
Low-Cost, Low-Height Wavesolderable Heat Sinks
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
273-AB-01
Dimensions
Dimensions
Footprint
Footprint
in. (mm)
in. (mm)
Dimensions
Footprint
in. (mm)
240 SERIES
Dimensions: in. (mm)
273 SERIES
274 SERIES
274-XAB-01
Configuration
Configuration
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Mounting
Mounting
Configuration
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Mounting
Vertical
Vertical
273-AB-02
Tab Options
Tab Options
Solderable
Solderable
Tab Options
Solderable
No Tab
No Tab
No Tab
No Tab
No Tab
No Tab
01
02
01
02
01
02
01
02
22
22
274-XAB-02
Clip/Mtg Hole
Clip/Mtg Slot
Mounting
Mounting
Mounting
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Style
Style
Style
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
Convection
49°C @ 2W
49°C @ 2W
49°C @ 2W
Convection
56°C @ 2W
56°C @ 2W
56°C @ 2W
50°C @ 2W
50°C @ 2W
50°C @ 2W
62°C @ 2W
62°C @ 2W
62°C @ 2W
56°C @ 2W
50°C @ 2W
Convection
55°C @ 4W
55°C @ 4W
Thermal Performance at Typical Load
Thermal Performance at Typical Load
NATURAL AND FORCED
Thermal Performance at Typical Load
NATURAL AND FORCED
Natural
Natural
Natural
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
Board Level
Heat Sinks
Convection
Convection
Convection
Forced
Forced
Forced
TO-218, TO-220
TO-220
TO-220
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