658-60ABT3 Wakefield Thermal Solutions, 658-60ABT3 Datasheet - Page 4

• Manufacturer Part Number: 658-60ABT3
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-60ABT3

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Height: 0.600" (15.20mm)
• Power Dissipation @ Temperature Rise: 2.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 15.24 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1075

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
PRODUCT FEATURES
14
12
10
8
6
4
2
0
Performance shown is with T4 thermal adhesive applied.
200
300
Approach Velocity, LFM
400
642-25-T4
642-35-T4
642-45-T4
642-60-T4
500
600