658-60ABT3 Wakefield Thermal Solutions, 658-60ABT3 Datasheet - Page 3
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658-60ABT3
Manufacturer Part Number
658-60ABT3
Description
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-60ABT3
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
27.94mm x 27.94mm
Height
0.600" (15.20mm)
Power Dissipation @ Temperature Rise
2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
3°C/W @ 300 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 15.24 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Color
Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1075
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
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