637-20ABP Wakefield Thermal Solutions, 637-20ABP Datasheet - Page 10

• Manufacturer Part Number: 637-20ABP
• Description: HEATSINK TO-220 VERT MT BLK 2"
• Manufacturer: Wakefield Thermal Solutions
• Series: 637r

Specifications of 637-20ABP

• Thermal Resistance: 4.7 C / W
• Height: 2.000" (50.8mm)
• Color: Black
• Package Cooled: TO-220
• Attachment Method: Bolt On and PC Pin
• Outline: 34.92mm x 12.70mm
• Power Dissipation @ Temperature Rise: 6W @ 55°C
• Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM
• Thermal Resistance @ Natural: 9.2°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 12.7 mm L x 35.05 mm W x 50.8 mm H
• Designed For: TO-220
• Packages Cooled: TO-220
• Width: 34.9mm
• Heat Sink Material: Aluminum
• Length: 12.7mm
• Mounting Type: PC Board Through Hole
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 345-1030

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
These exceptionally low-cost heat sinks can be mounted horizontally under a
TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4).
For added performance, a 271 Series heat sink can also be used for double-sided heat dissi-
Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate
one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with
Normally stocked
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
289 SERIES
270 SERIES
272 SERIES
Standard
P/N
270-AB
272-AB
280-AB
Material: Aluminum, Black Anodized
289 AND 290 SERIES
Standard
P/N
289-AP
290-1AB
290-2AB
Material: Aluminum, Black Anodized
270/272/280 SERIES
289-AB
Height Above
MECHANICAL DIMENSIONS
0.375 (9.4)
0.375 (9.4)
0.375 (9.4)
PC Board
in. (mm)
Height Above
0.500 (12.7)
0.500 (12.7)
0.500 (12.7)
0.500 (12.7)
PC Board
Small Footprint Low-Cost Heat Sinks
Low-Cost Single or Dual Package Heat Sinks
in. (mm)
1.750 (44.5) x 0.700 (17.8)
1.750 (44.5) x 1.450 (36.8)
1.750 (44.5) x 0.700 (17.8)
Horizontal Mounting
Maximum Footing
in. (mm)
280 SERIES
1.000 (25.4) x O.710 (18.1)
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 1.180 (30.0)
1.000 (25.4) x 1.180 (30.0)
Horizontal Mounting
Maximum Footing
290 SERIES
in. (mm)
39
two power semiconductors. Specify solderable tab options for the 272 Series by the addition
of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style.
pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for
Tab Options
Solderable
01,02
Dimensions: in. (mm)
—
—
All other products, please contact factory for price, delivery, and minimums.
70°C @ 4W
42°C @ 4W
70°C @ 4W
50°C @ 2W
50°C @ 2W
44°C @ 2W
44°C @ 2W
Convection
Convection
Thermal Performance at Typical Load
Thermal Performance at Typical Load
Natural
Natural
272AB01
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
NATURAL AND FORCED
6.0°C/W @ 400 LFM
3.6°C/W @ 400 LFM
6.0°C/W @ 400 LFM
44°C/W @ 400 LFM
44°C/W @ 400 LFM
35°C/W @ 400 LFM
35°C/W @ 400 LFM
Convection
Convection
Forced
Forced
272AB02
TO-218, TO-202, TO-220
Board Level
Heat Sinks
TO-220, TO-202
0.0055 (2.49)
0.0055 (2.49)
0.0082 (3.72)
0.0081 (3.67)
lbs. (grams)
0.0052 (2.36)
0.0105 (5.72)
0.0048 (2.18)
lbs. (grams)
Weight
Weight