270-AB Wakefield Thermal Solutions, 270-AB Datasheet - Page 3
![HEATSINK TO-220 SM FOOTPRINT BLK](/photos/5/88/58832/270-ab_sml.jpg)
270-AB
Manufacturer Part Number
270-AB
Description
HEATSINK TO-220 SM FOOTPRINT BLK
Manufacturer
Wakefield Thermal Solutions
Series
270r
Specifications of 270-AB
Thermal Resistance
6 C / W
Height
0.375" (9.53mm)
Color
Black
Package Cooled
TO-220, TO-202
Attachment Method
Bolt On
Outline
44.45mm x 17.78mm
Power Dissipation @ Temperature Rise
4W @ 70°C
Thermal Resistance @ Forced Air Flow
6.0°C/W @ 400 LFM
Thermal Resistance @ Natural
17.5°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
28.45 mm L x 11.05 mm W x 19.05 mm H
Designed For
TO-220, TO-202
Packages Cooled
TO-202 / TO-220
Width
17.8mm
Heat Sink Material
Aluminum
Length
44.5mm
Mounting Type
Screw
Size
1.75L X 0.375H X 0.530W"
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1041
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
24
MECHANICAL DIMENSIONS
PATENT PENDING
Board Level
Heat Sinks
Dimensions: in. (mm)
234 SERIES
MECHANICAL DIMENSIONS
234-75AB
6/14/07
Standard
P/N
230-75AB
230-75ABE-01
230-75ABE-05
230-75ABE-10
234-75AB
234-75ABE-01
234-75ABE-05
Material: Aluminum, Black Anodized
Standard
P/N
206-1PABEH
Material: Aluminum, Black Anodized
230 & 234 SERIES
206 SERIES
10:54 AM
230-75AB-01
Height Above
.750 (19.1)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
.500 (12.7)
PC Board
in. (mm)
Page 24
234-75AB-01
Vertical Mount Heat Sink
230-75AB-10
Height Above
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
1.18 (30.0)
PC Board
in. (mm)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
Footprint
in. (mm)
230 AND 234 SERIES
234-75AB-05
1.00 (25.4) x .50 (12.7)
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Horizontal
Mounting
Maximum
Vertical
Vertical
Vertical
Footprint
in. (mm)
100
80
60
40
20
Solderable
0
230-75AB-05
Option
No Tab
No Tab
234 SERIES
0
0
Tab
01
05
10
01
05
CONVECTION CHARACTERISTICS
200
200
2
Natural Convection
NATURAL AND FORCED
56°C rise @ 4W
HEAT DISSIPATED (WATTS)
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
AIR VELOCITY (LFM)
Style
400
400
4
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
600
600
6
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
800
800
8
230 SERIES
1000
1000
10
7.3°C/W @ 200LFM
Forced Convection
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
10
8
6
4
2
0
Convection)
Forced
TO-220
TO-220