274-2AB Wakefield Thermal Solutions, 274-2AB Datasheet - Page 2

• Manufacturer Part Number: 274-2AB
• Description: HEATSINK LOW HEIGHT BLK TO-220
• Manufacturer: Wakefield Thermal Solutions
• Series: 274r

Specifications of 274-2AB

• Thermal Resistance: 7 C / W
• Height: 0.500" (12.70mm)
• Color: Black
• Package Cooled: TO-220
• Attachment Method: Bolt On
• Outline: 19.05mm x 12.70mm
• Power Dissipation @ Temperature Rise: 2W @ 50°C
• Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 400 LFM
• Thermal Resistance @ Natural: 25°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 19.05 mm L x 12.7 mm W x 13.46 mm H
• Designed For: TO-220
• Packages Cooled: TO-220
• Width: 46mm
• Heat Sink Material: Aluminum
• Length: 13.2mm
• Size: 0.75L X 0.500H X 0.520W"
• Mounting Type: Screw
• Package / Case: TO-220
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 2742AB; 345-1087

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
MECHANICAL DIMENSIONS
PATENT PENDING
MECHANICAL DIMENSIONS
Dimensions: in.
Dimensions: in. (mm)
Normally stocked
217 SERIES
234 SERIES
TUBE: 16.25 Inches Long,
20 Pieces per Tube
Min. ESDMaterial with Nail
Stops
TUBE DETAILS
234-75AB
217-36CTT6
Surface Mount Heat Sinks
230 AND 234 SERIES
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Material: Aluminum, Black Anodized
230-75AB-01
Height Above
.750 (19.1)
.500 (12.7)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
PC Board
in. (mm)
234-75AB-01
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
230-75AB-10
BOARD LAYOUT RECOMMENDATIONS
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
in. (mm)
Footprint
230 AND 234 SERIES
234-75AB-05
31
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Mounting
Horizontal
Vertical
Vertical
Vertical
SOL 20
Solderable
All other products, please contact factory for price, delivery, and minimums.
230-75AB-05
No Tab
No Tab
Option
234 SERIES
Tab
01
05
10
01
05
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
Style
CONVECTION CHARACTERISTICS
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
230 SERIES
217-36CT6
D
2
PAK, TO-220, SOL-20
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
Board Level
Heat Sinks
Convection)
Forced
TO-220