TXP1808B CTS Thermal Management Products, TXP1808B Datasheet

TXP1808B

Manufacturer Part Number

TXP1808B

Description

THERMAL LINK PRESS ON BLACK TO-1

Manufacturer

CTS Thermal Management Products

Datasheets

1.TXP1808B.pdf (2 pages)

2.TXP1808B.pdf (3 pages)

Specifications of TXP1808B

Rohs Status

RoHS non-compliant

Package Cooled

TO-18

Attachment Method

Press Fit

Outline

5.59mm Dia

Height

0.34" (8.64mm)

Power Dissipation @ Temperature Rise

Thermal Resistance @ Forced Air Flow

Thermal Resistance @ Natural

Other names

294-1123

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CTS

iZIF

GENERAL DESCRIPTION

the PCB retainer for improved structural integrity and thermal

efficiency (.8°C-in./W). The iZIF

pending design for rugged military and aerospace circuit card

applications. It features a quarter-turn lock, uniform clamping

pressure, and can be sized to fit small daughter cards up to

9U VME. A bottom plate may also be added for additional

cooling and structural integrity. The iZIF

stainless steel socket head cap rod with beryllium copper

spring. A variety of finishes are available such as chemical

film, black anodize, and electroless nickel.

THERMAL LINKS

GENERAL DESCRIPTION

of the 6 to 8-segment fingers versus the 2 or 3-segment

fingers available from other manufacturers. These thermal

links are offered for TO-5s, TO-8s and TO-18s with or

without BeO washer and other appropriate hardware.

path between semiconductor and heat sinks or chassis.

FAN TOP SERIES

They provide an effective retainer and efficient thermal

CTS’s thermal links provide superior retention because

The iZIF

™

HEAT FRAME

™

is a custom aluminum heat frame that integrates

Fan Tops

*Natural convection, case-ambient mounted on G10 board

Dim.

“A”

.25

.36

.33

.12

1.25

Dim.

“B”

.50

.75

Semiconductor

Case Type

TO-18

TO-5

TO-8

TO-5

TO-8

™

is a highly reliable patent-

*Ø °C/W

150.0

81.1

57.7

41.0

56.6

™

features a 1/8”

TXBF2-032-036U TXBF2-032-036B

TXBF2-050-033U TXBF2-050-033B

TXBF-019-025U

TXCF-019-025U

TXBF-032-025U

TXCF-032-025U

TXCF-125-1U

TXCF-125-2U

Unplated

vibration and shock loads. The thermal links can be

inserted and removed multiple times without loss of

retention or damage to the finish over the entire JEDEC

case diameter range. They can be installed with a rivet or

eyelet, soldered to a PC pad or heat sink, mounted with a

single screw or with a threaded stud and hex nut.

Black Cadmium

Part Number

TXBF-019-025B

TXBF-032-025B

TXCF-125-1CB

TXCF-125-2B

There is excellent transistor retention under high

N.A.

TXCF-019-025CB

TXCF-032-025CB

Black Chem.

N.A.

BeCu Retainer

Brass Fan

Material

Brass

BeCu

Related parts for TXP1808B

TXP1808B Summary of contents

Page 1

CTS ® iZIF ™ HEAT FRAME GENERAL DESCRIPTION The iZIF ™ custom aluminum heat frame that integrates the PCB retainer for improved structural integrity and thermal efficiency (.8°C-in./W). The iZIF ™ pending design for rugged military and aerospace ...

Page 2

... TXB2P-032-037B 7 TO-5 TX0507-1B 7 TO-5 TX0507-2B 8 TO-5 TX0547B Thermal Link Retainers With BeO Insulators Fig. Semiconductor # Case Type Black Cadmium Finish Dull Nickel Finish 1 TO-18 TXP1803B 1 TO-18** TXP1808B 2 TO-18 TX1806B 2 TO-18 TX1806-1B 3 TO-18 TX1822B 4 TO-18 — 5 TO-5 TXP0503B 5 TO-5** TXP0508B 6 TO-5 TX0506-1B ...

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