BDN16-3CB/A01 CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.61"SQ

BDN16-3CB/A01

Manufacturer Part Number

BDN16-3CB/A01

Description

HEATSINK CPU W/ADHESIVE 1.61"SQ

Manufacturer

CTS Thermal Management Products

Series

BDNr

Specifications of BDN16-3CB/A01

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Included)

Outline

40.89mm x 40.89mm

Height

0.35" (9mm)

Thermal Resistance @ Forced Air Flow

4.5°C/W @ 400 LFM

Thermal Resistance @ Natural

13.5°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

-

Other names

294-1103

Related parts for BDN16-3CB/A01

Related keywords

BDN16-3CB/A01 component
BDN16-3CB/A01 part
BDN16-3CB/A01 distributor
BDN16-3CB/A01 RoHS