BDN17-3CB/A01 CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.71"SQ

BDN17-3CB/A01

Manufacturer Part Number

BDN17-3CB/A01

Description

HEATSINK CPU W/ADHESIVE 1.71"SQ

Manufacturer

CTS Thermal Management Products

Series

BDNr

Specifications of BDN17-3CB/A01

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Thermal Tape, Adhesive (Included)

Outline

43.43mm x 43.43mm

Height

0.35" (9mm)

Thermal Resistance @ Forced Air Flow

3.8° C/W @ 400 LFM

Thermal Resistance @ Natural

11.5°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

-

Other names

294-1111
BDN173CBA01

Related parts for BDN17-3CB/A01

Related keywords

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