PCKEL14PW-T NXP Semiconductors, PCKEL14PW-T Datasheet
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PCKEL14PW-T
Specifications of PCKEL14PW-T
Related parts for PCKEL14PW-T
PCKEL14PW-T Summary of contents
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PCKEL14 2.5 V/3.3 V PECL/ECL 1:5 clock distribution chip Rev. 01 — 14 October 2002 1. Description The PCKEL14 is a low skew 1:5 clock distribution chip designed explicitly for low skew clock distribution applications. The device can be driven ...
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Philips Semiconductors 3. Pinning information 3.1 Pinning Fig 1. SO20 pin configuration. 3.2 Pin description Table 1: Symbol Q0-Q4 Q0- SEL V BB CLK CLK SCLK 3.2.1 Power supply connection CAUTION 9397 750 09564 ...
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... Table 2: Ordering information Type number Package Name Description PCKEL14D SO20 plastic small outline package; 20 leads; body width 7.5 mm PCKEL14PW TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4 Logic diagram Fig 3. Logic diagram. CAUTION 6. Function table Table Don’t care. ...
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Philips Semiconductors 7. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V power supply CC V power supply EE V input voltage I I output current sink/source ...
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Philips Semiconductors 8. Static characteristics Table 5: PECL DC characteristics [ 2 Symbol Parameter I power supply current EE V HIGH-level output OH voltage V LOW-level output OL voltage V HIGH-level ...
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Philips Semiconductors Table 6: Positive DC characteristics [ 3 Symbol Parameter Conditions I power supply current EE V HIGH-level output OH voltage V LOW-level output OL voltage V HIGH-level input single-ended ...
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Philips Semiconductors Table 7: Negative DC characteristics 2.375 Symbol Parameter Conditions I power supply EE current V HIGH-level OH output voltage V LOW-level OL output voltage V HIGH-level ...
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Philips Semiconductors 9. Dynamic characteristics Table 8: AC characteristics (V = 2.375 Symbol Parameter Conditions f maximum toggle see max frequency t LOW-to-HIGH CLK to Q (diff); PLH ...
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Philips Semiconductors 900 V O (mV p-p ) 800 700 600 500 400 300 200 100 0 Fig 150 mV and 1000 mV input. max 10. Application information Fig 5. Typical termination for output driver and device ...
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Philips Semiconductors 11. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 ...
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Philips Semiconductors 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...
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Philips Semiconductors 14. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...