BTA25-600BW STMicroelectronics, BTA25-600BW Datasheet - Page 5

TRIAC 600V 25A RD-91

BTA25-600BW

Manufacturer Part Number
BTA25-600BW
Description
TRIAC 600V 25A RD-91
Manufacturer
STMicroelectronics
Series
Snubberless™r
Type
TRIACr
Datasheet

Specifications of BTA25-600BW

Triac Type
Alternistor - Snubberless
Mounting Type
Chassis Mount
Configuration
Single
Current - Hold (ih) (max)
75mA
Voltage - Off State
600V
Current - Gate Trigger (igt) (max)
50mA
Current - Non Rep. Surge 50, 60hz (itsm)
250A, 260A
Current - On State (it (rms)) (max)
25A
Voltage - Gate Trigger (vgt) (max)
1.3V
Package / Case
RD91-3 (Insulated)
Current - On State (it (rms) (max)
25A
Peak Repetitive Off-state Voltage, Vdrm
600V
Gate Trigger Current Max (qi), Igt
50mA
On State Rms Current It(rms)
25A
Peak Non Rep Surge Current Itsm 50hz
250A
Holding Current Max Ih
75mA
Repetitive Peak Off-state Volt
600V
Off-state Voltage
600V
Hold Current
75mA
Gate Trigger Current (max)
50mA
Gate Trigger Voltage (max)
1.3V
Package Type
RD-91
Peak Repeat Off Current
5uA
Peak Surge On-state Current (max)
260A
On State Voltage(max)
1.55@35AV
Mounting
Through Hole
Pin Count
3
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-3125
497-3125-5
497-3125

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BTA25-600BW
Manufacturer:
ST
Quantity:
2 000
Part Number:
BTA25-600BW
Manufacturer:
ST
0
Part Number:
BTA25-600BWRG
Manufacturer:
ST
0
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Figure 7.
Figure 9.
Figure 11. D
80
70
60
50
40
30
20
10
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
3000
1000
0
100
0
0.1
R
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
0.01
th(j-a)
I
TSM
B
dI/dt limitation:
4
(°C/W)
(A), I t (A s)
50A/µs
Non-repetitive surge peak on-state
current for a sinusoidal pulse with
width t
value of I
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
8
2
2
PAK thermal resistance junction to
2
12
1.0
0.10
p
(dV/dt)c (V/µs)
< 10 ms and corresponding
16
2
t
S(cm²)
t (ms)
p
20
24
10.0
1.00
28
I t
2
T2535/CW/BW
I
32
TSM
T initial=25°C
j
D PAK
2
36
10.00
100.0
40
Figure 8.
Figure 10. Relative variation of critical rate of
2.5
2.0
1.5
1.0
0.5
0.0
6
5
4
3
2
1
0
(dI/dt)c [T ] /
0
-40
I
GT H L
,I ,I [T ] /
-20
I
H
& I
j
L
25
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
I
decrease of main current versus T
j
GT
(dI/dt)c [T s
0
I
GT H L
,I ,I [T =25°C]
20
j
50
j
pecified]
40
T (°C)
T (°C)
j
j
60
75
80
Characteristics
100
100
120
140
125
5/12
j

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