145246-1 TE Connectivity, 145246-1 Datasheet - Page 154

Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD

145246-1

Manufacturer Part Number
145246-1
Description
Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Card Edger
Datasheets

Specifications of 145246-1

Number Of Contacts
184
Contact Plating
Gold Over Nickel
Mounting
Surface Mount
Termination Method
Solder
Pitch
1.27 mm
Number Of Rows
2
Number Of Contact Rows
2
Body Orientation
Straight
Contact Material
Phosphor Bronze
Mounting Style
Surface Mount
Product Height (mm)
15.49mm
Operating Temp Range
-55C to 85C
Pitch (mm)
1.27mm
Housing Material
Thermoplastic
Housing Color
Natural
Current Rating (max)
1/ContactA
Voltage Rating Max
203VAC
Contact Resistance Max
30
Peak Reflow Compatible (260 C)
No
Body Material
Polyphenylene Sulfide
Leaded Process Compatible
No
Rohs Compliant
No
Pcb Mounting Orientation
Vertical
Number Of Dual Positions
92
Pcb Mount Style
Surface Mount
Holddown Material
Brass
Holddown Plating
Tin-Lead over Nickel
Voltage (vac)
3.3
Solder Tail Contact Plating
Tin-Lead over Nickel
Number Of Positions
184
Centerline (mm [in])
1.27 [0.050]
Bus Width
64 Bit
Pcb Mount Retention Type
Hold Down Post(s)
Ejector
Without
Number Of Holddowns
3
Family Name
PCI
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Phosphor Bronze
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Lead Free Status / RoHS Status
Not Compliant
154
Product Facts
*Consult Tyco Electronics engi-
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
neering when paralleling con-
tacts for power applications.
Crimp snap-in, solder eye-
let, .025 [0.64] square
posted and right angle
contacts on .100 [2.54],
.125 [3.18] or .156 [3.96]
centers
Customer buys only enough
contacts to meet circuit and
retention requirements
Contacts bifurcated for
redundancy
Single leaf version avail-
able for higher contact
normal forces
Low insertion forces
Accommodates AWG 16-28
[1.4-0.08 mm
and insulation diameters
.035-.105 [0.89-2.67]
Large variety of connector
sizes
Cavity identification on face
of card slot and wire entry
High speed automatic
machine terminations
provide uniform reliability
at lowest applied cost
Recognized under the
Component Program of
Underwriters
Laboratories Inc.
File No. E28476
Certified by Canadian
Standards
Association
File No. LR 7189
2
] wire range
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
The Crimp Snap Twin Leaf
Connector is designed
especially for high density
wire-to-board applications.
Termination styles include
crimp, solder, posted and
right angle, in a variety of
s i z e s .
Card Edge Connectors
(Board-to-Board, Wire-to-Board)
Crimp Snap Twin Leaf Connectors
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Design flexibility allows the
customer to save by pur-
chasing only enough
contacts for the circuit
requirements. Easy replace-
ability of each contact cuts
repair cost in the event of
contact or wire damage.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Performance Specifications
Contact Rating*: 5 amperes,
continuous 3 amperes, max. (for .025
[0.64] posted contacts)
Contact Resistance:
10 milliohms, max.
Insulation Resistance:
5000 megohms (initial)
1000 megohms
Voltage Rating:
.100 [2.54] Centerline-1000 Vrms
.125 [3.18] Centerline-1500 Vrms
.156 [3.96] Centerline-1800 Vrms
Insertion Force (per pair): Twin
Leaf-10 oz. [2.78 N], max.; 7.6 oz.
[2.11 N], avg. Non-Bifurcated Contacts-
20 oz. [5.57 N], max.
Extraction Force (per pair): Twin
Leaf-0.7 oz. [0.195 N], min.; 1.2 oz.
[0.334 N], avg.
Operating Temperature:
-55°C to +105°C
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967

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