145246-1 TE Connectivity, 145246-1 Datasheet - Page 127

• Manufacturer Part Number: 145246-1
• Description: Conn Card Edge SKT 184 POS 1.27mm Solder ST SMD
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 145246-1

• Number Of Contacts: 184
• Contact Plating: Gold Over Nickel
• Mounting: Surface Mount
• Termination Method: Solder
• Pitch: 1.27 mm
• Number Of Rows: 2
• Number Of Contact Rows: 2
• Body Orientation: Straight
• Contact Material: Phosphor Bronze
• Mounting Style: Surface Mount
• Product Height (mm): 15.49mm
• Operating Temp Range: -55C to 85C
• Pitch (mm): 1.27mm
• Housing Material: Thermoplastic
• Housing Color: Natural
• Current Rating (max): 1/ContactA
• Voltage Rating Max: 203VAC
• Contact Resistance Max: 30
• Peak Reflow Compatible (260 C): No
• Body Material: Polyphenylene Sulfide
• Leaded Process Compatible: No
• Rohs Compliant: No
• Pcb Mounting Orientation: Vertical
• Number Of Dual Positions: 92
• Pcb Mount Style: Surface Mount
• Holddown Material: Brass
• Holddown Plating: Tin-Lead over Nickel
• Voltage (vac): 3.3
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Number Of Positions: 184
• Centerline (mm [in]): 1.27 [0.050]
• Bus Width: 64 Bit
• Pcb Mount Retention Type: Hold Down Post(s)
• Ejector: Without
• Number Of Holddowns: 3
• Family Name: PCI
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Lead Free Status / RoHS Status: Not Compliant

Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Product Facts
High density .050" [1.27]
center spacing.
Staggered contacts for low
insertion force.
Designed for multi-layer
.093" [2.36] daughter cards.
High temperature SMT sol-
der reflow temperatures of
260° for 30 seconds.
Unique pin geometry allows
for even distribution of
forces reducing axial pin
rotation and preserving per-
pendicularity to the
PCB board.
Edge and side coining pro-
vides a uniform pin radius
ensuring maximum contact
without "skiving"
the plated hole.
Full complement of applica-
tion tooling available.
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E60980
Certified by Canadian
Standards
Association,
File No. LR 49571
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
®
High Density (.050" [1.27]
center spacing) Press-Fit
connectors from Tyco
Electronics are designed for
high density backplane or
mid-plane applications.
Compliant pin connectors
from Tyco Electronics meet
or exceed requirements of
current industry standards,
including Bellcore specifica-
tions, which address critical
performance issues such as
hole retention, hole deforma-
tion and environmental per-
f o r m a n c e .
Card Edge Connectors
(Press-Fit Board-To-Board)
High Density Press-Fit Card Edge
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Electrical Characteristics:
Operating Voltage–600VDC (sea
level)
Current Rating –1.5 Amperes
Initial Contact Resistance –
30 milliohms
Environmental
Characteristics:
Operating Temperature –
-55˚C to +125˚C
Temperature Cycling –
MIL-STD-202 method 107
Vibration–
MIL-STD-202, method 204
USA: 1-800-522-6752
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