SGSD200 STMicroelectronics, SGSD200 Datasheet
SGSD200
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SGSD200
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SGSD200 Summary of contents
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... General purpose switching applications Description The SGSD100 is an epitaxial-base NPN power transistor in monolithic Darlington configuration mounted in TO-247 plastic package inteded for use in general purpose and high current amplifier applications. The complementary PNP type is the SGSD200. Table 1. Device summary Order code SGSD100 SGSD200 January 2008 ...
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... For PNP type voltage and current values are negative Table 3. Thermal data Symbol R Thermal resistance junction-case max thj-case 2/10 Parameter = < 5ms) P < 5ms) P ≤ 25°C c Parameter SGSD100 SGSD200 Value Unit NPN SGSD100 PNP SGSD200 130 -65 to 150 150 Value Unit 0.96 °C/W ...
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... SGSD100 SGSD200 2 Electrical characteristics ( °C; unless otherwise specified) case Electrical characteristics Table 4. Symbol Parameter Collector cut-off current I CBO ( Collector cut-off current I CEV (V = -0.3V) BE Collector cut-off current I CEO ( Emitter cut-off current I EBO ( Collector-emitter sustaining (1) V CEO(sus) voltage ( Collector-emitter saturation (1) V CE(sat) voltage ...
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... Second breakdown energy s/b I Second breakdown current s/b 1. Pulsed : Pulse duration = 300 µs, duty cycle Note: For PNP type voltage and current values are negative 4/10 Test conditions 100 500 ms CE ≤ 1.5% SGSD100 SGSD200 Min. Typ. Max. Unit mJ 250 o 250 ...
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... SGSD100 SGSD200 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 4. DC current gain (PNP type) Figure 6. DC current gain (PNP type) Figure 3. DC current gain (NPN type) Figure 5. DC current gain (NPN type) Figure 7. Collector-emitter saturation voltage (NPN type) Electrical characteristics ...
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... Electrical characteristics Figure 8. Base-emitter saturation voltage (PNP type) 6/10 SGSD100 SGSD200 ...
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... SGSD100 SGSD200 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Package mechanical data Dim øP øR S 8/10 TO-247 Mechanical data mm. Min. Typ 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 SGSD100 SGSD200 Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 14.80 4.30 3.65 5.50 ...
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... SGSD100 SGSD200 4 Revision history Table 5. Document revision history Date Revision 11-Oct-2003 24-Jan-2007 3 4 Package change from TO-218 to TO-247. Revision history Changes 9/10 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com SGSD100 SGSD200 ...