MT48LC16M8A2TG-75:G Micron Technology Inc, MT48LC16M8A2TG-75:G Datasheet - Page 74

• Manufacturer Part Number: MT48LC16M8A2TG-75:G
• Description: DRAM Chip SDRAM 128M-Bit 16Mx8 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC16M8A2TG-75:G

• Package: 54TSOP-II
• Density: 128 Mb
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C

Figure 58:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
set forth herein. Although considered final, these specifications are subject to change, as further product development and
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
6.40
54-Ball VFBGA “F4/B4” Package (x16 device), 8mm x 8mm
0.10 C
BALL A9
3.20
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
0.65 ±0.05
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.40mm SMD.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
data characterization sometimes occur.
their respective owners.
0.80 TYP
C L
BALL A1
BALL A1 ID
74
4.00 ±0.05
®
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
128Mb: x4, x8, x16 SDRAM
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.40
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
BALL A1 ID