AUSTIN LITE 5.0V 2.5V Lineage Power, AUSTIN LITE 5.0V 2.5V Datasheet - Page 19

• Manufacturer Part Number: AUSTIN LITE 5.0V 2.5V
• Manufacturer: Lineage Power

Specifications of AUSTIN LITE 5.0V 2.5V

• Lead Free Status / RoHS Status: Not Compliant

March 26, 2008
Lineage Power
Surface Mount Information
Lead Free Soldering
The –Z version Austin Lite SMT modules are lead-free (Pb-
free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering pro-
cess. Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Mois-
ture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices) for both Pb-free solder pro-
files and MSL classification procedures. This standard pro-
vides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-
2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu sol-
der is shown in Figure. 52.
MSL Rating
The Austin Lite SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling pro-
cedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of £ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf
life for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assem-
bly process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished cir-
cuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Lineage Power
Board Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
Figure 52. Recommended linear reflow profile using
300
250
200
150
100
50
Per J-STD-020 Rev. C
0
Sn/Ag/Cu solder.
Heating
Zone
Reflow Time (Seconds)
Peak Temp
* Min. Time
Above 235°C
*Time Above
217°C
(continued)
3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
Cooling
Zone
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be loose
nor violate the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
19