AUSTIN LITE 5.0V 2.5V Lineage Power, AUSTIN LITE 5.0V 2.5V Datasheet - Page 18

• Manufacturer Part Number: AUSTIN LITE 5.0V 2.5V
• Manufacturer: Lineage Power

Specifications of AUSTIN LITE 5.0V 2.5V

• Lead Free Status / RoHS Status: Not Compliant

Lineage Power
Surface Mount Information
Pick and Place Area
Placement of the Austin Lite can be achieved by choosing
one of the below points.
Recommended Location
n
Alternate Locations
n
n
If rotational slipping occurs, rubber tipped nozzles can be uti-
lized to prevent slippage.
These recommendations are general and apply only to
machines that use vacuum nozzles to place components.
Machines with the capability of adding mechanical gripping to
the sides of assembly can also be utilized.
Testing with a specific placement machine is recommended
to determine optimal placement procedures.
Figure 49. Austin Lite Top side view.
Pick Point 1:
Pick Points 2 and 3:These points provide a location that is
Pick Point 4:This point is only available to machines that can
March 26, 2008
the surface mount inductors, provides the largest and most
versatile pick point. This label is 0.340” x 0.440”. Up to an
8-mm outside diameter nozzle can be utilized to obtain
maximum vacuum pick-up. Smaller diameter nozzles can
also be utilized. For all nozzle sizes, travel and rotation
speeds may need to be reduced. this off center pick point
may pose some challenges for some vision recognition
systems.
closest to the center of gravity on the x-axis centerline. A
nozzle size of 2.5mm to 3.7mm can be utilized in these
locations. Care is needed to avoid nozzle contact with
adjacent components. Placement system accuracy needs
to be verified. Travel and rotations speeds will need to be
reduced. It is possible that a custom nozzle can be
designed to utilize both of these points simultaneously.
move off of the x-axis centerline. It provides a larger sur-
face area and is close to the center of gravity. A 4-mm out-
side diameter nozzle can be utilized. Travel and rotations
speeds will need to be reduced.
The Product ID label, which is attaced over
3.3 Vdc and 5.0 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 5A
Tin Lead Soldering
The Austin Lite SMT power modules are lead free modules
and can be soldered either in a lead-free solder process or in
a conventional Tin/Lead (Sn/Pb) process. It is recommended
that the customer review data sheets in order to customize
the solder reflow profile for each application board assembly.
The following instructions must be observed when soldering
these units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and can
adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
the eutectic solder melts at 183
quently wicks the device connection. Sufficient time must be
allowed to fuse the plating on the connection to ensure a reli-
able solder joint. There are several types of SMT reflow tech-
nologies currently used in the industry. These surface mount
power modules can be reliably soldered using natural forced
convection, IR (radiant infrared), or a combination of convec-
tion/IR. For reliable soldering the solder reflow profile should
be established by accurately measuring the modules CP con-
nector temperatures.
Figure 50. Reflow Profile.
Figure 51.
220
200
180
160
140
120
100
80
60
40
20
0
0
ALLOY: Sn63Pb37 or Sn62Pb36Ag02
240
235
230
225
220
205
200
215
210
<2.5 ˚C/SEC
30
0
Time Limit curve above 205
60
0.5 - 0.6 ˚C/SEC
10
PRE-HEATING
2.0 - 4.0 MIN
90
SOAKING ZONE
20
2.0 MIN MAX
60 - 90 SEC
120
TIME (SECONDS)
TIME (S)
1.3 - 1.6 ˚C/SEC
150
o
30
C, wets the land, and subse-
180
30 - 90 SEC MAX
30 - 60 SEC
REFLOW ZONE
40
210
0
C.
50
PEAK TEMP.
210 - 235 ˚C
240
o
C. Typically,
60
270
18