NSS40600CF8T1G ON Semiconductor, NSS40600CF8T1G Datasheet - Page 5

• Manufacturer Part Number: NSS40600CF8T1G
• Description: TRANSISTOR PNP 6A 40V 8CHIPFET
• Manufacturer: ON Semiconductor

Specifications of NSS40600CF8T1G

• Transistor Type: PNP
• Current - Collector (ic) (max): 6A
• Voltage - Collector Emitter Breakdown (max): 40V
• Vce Saturation (max) @ Ib, Ic: 220mV @ 400mA, 4A
• Current - Collector Cutoff (max): 10µA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 220 @ 1A, 2V
• Power - Max: 830mW
• Frequency - Transition: 100MHz
• Mounting Type: Surface Mount
• Package / Case: 8-ChipFET™
• Configuration: Single Hex Collector
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 40 V
• Emitter- Base Voltage Vebo: 7 V
• Continuous Collector Current: - 6 A
• Maximum Dc Collector Current: 6 A
• Power Dissipation: 830 mW
• Maximum Operating Frequency: 100 MHz
• Maximum Operating Temperature: + 150 C
• Dc Collector/base Gain Hfe Min: 250
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
e1
ChipFET is a trademark of Vishay Siliconix.
LITERATURE FULFILLMENT:
H
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [e-mail]
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
E
0.457
0.018
8
1
7
2
D
e
0.026
0.66
6
3
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
5
4
Basic
2.032
0.028
0.08
0.711
b
E
A
q
c
SCALE 20:1
0.05 (0.002)
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.635
0.025
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
L
inches
mm
http://onsemi.com
CASE 1206A−03
5
4
ChipFET
ISSUE G
6
3
5
7
2
*For additional information on our Pb−Free strategy and soldering
0.457
0.018
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD
0.026
0.66
DIM
H
AND VERTICAL SHALL NOT EXCEED 0.08 MM.
SURFACE.
e1
A
D
E
q
b
c
e
L
E
1.00
0.25
0.10
2.95
1.55
0.28
1.80
MIN
Style 4
2.032
0.028
0.08
0.711
MILLIMETERS
0.65 BSC
0.55 BSC
5° NOM
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NOM
1.05
0.30
0.15
3.05
1.65
0.35
1.90
MAX
SCALE 20:1
1.10
0.35
0.20
3.10
1.70
0.42
2.00
0.039
0.010
0.004
0.116
0.061
0.011
0.071
MIN
NSS40600CF8/D
1.727
0.068
inches
mm
0.025 BSC
0.022 BSC
INCHES
5° NOM
0.041
0.012
0.006
0.120
0.065
0.014
0.075
NOM
0.178
0.007
0.043
0.014
0.008
0.122
0.067
0.017
0.079
MAX