NSS40600CF8T1G
40 V, 7.0 A, Low V
PNP Transistor
transistors are miniature surface mount devices featuring ultra low
saturation voltage (V
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
in portable and battery powered products such as cellular and cordless
phones, PDAs, computers, printers, digital cameras and MP3 players.
Other applications are low voltage motor controls in mass storage
products such as disc drives and tape drives. In the automotive
industry they can be used in air bag deployment and in the instrument
cluster. The high current gain allows e
driven directly from PMU’s control outputs, and the Linear Gain
(Beta) makes them ideal components in analog amplifiers.
•
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ 100 mm
2. FR−4 @ 500 mm
3. Thermal response.
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 2
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current − Continuous
Collector Current − Peak
Electrostatic Discharge
Total Device Dissipation, T
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation, T
Derate above 25°C
Thermal Resistance,
Junction−to−Ambient
Thermal Resistance,
Junction−to−Lead #1
Total Device Dissipation
(Single Pulse < 10 sec)
Junction and Storage
Temperature Range
ON Semiconductor’s e
Typical applications are DC−DC converters and power management
This is a Pb−Free Device
Characteristic
Rating
2
2
, 1 oz copper traces.
, 1 oz copper traces.
CE(sat)
(T
A
A
A
= 25°C)
= 25°C
= 25°C
) and high current gain capability. These
2
PowerEdge family of low V
R
R
R
(Notes 2 & 3)
P
P
qJA
qJA
qJL
D
D
Symbol
Symbol
P
T
V
V
V
(Note 1)
(Note 2)
ESD
Dsingle
J
I
(Note 1)
(Note 2)
(Note 2)
CEO
CBO
EBO
, T
2
CM
I
C
PowerEdge devices to be
stg
CE(sat)
−55 to
+150
HBM Class 3B
Max
−7.0
−6.0
−7.0
Max
11.1
2.75
−40
−40
830
150
6.7
1.4
90
15
MM Class C
1
mW/°C
mW/°C
°C/W
°C/W
°C/W
CE(sat)
Unit
Unit
Vdc
Vdc
Vdc
Adc
mW
°C
W
W
A
†For information on tape and reel specifications,
NSS40600CF8T1G
PNP LOW V
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
EQUIVALENT R
Device
−40 VOLTS, 7.0 AMPS
ORDERING INFORMATION
BASE
MARKING DIAGRAM
VA = Specific Device Code
M = Month Code
G = Pb−Free Package
PIN CONNECTIONS
http://onsemi.com
4
C
C
C
E
CE(sat)
8
7
6
5
COLLECTOR
1, 2, 3, 6, 7, 8
(Pb−Free)
VA M
Package
ChipFET
EMITTER
G
Publication Order Number:
5
DS(on)
TRANSISTOR
CASE 1206A
1
2
3
4
ChipFET]
STYLE 4
C
C
C
B
NSS40600CF8/D
Tape & Reel
45 mW
Shipping
3000/
†