MMBT4124LT1G ON Semiconductor, MMBT4124LT1G Datasheet

TRANS NPN GP 20V 200MA SOT-23

MMBT4124LT1G

Manufacturer Part Number
MMBT4124LT1G
Description
TRANS NPN GP 20V 200MA SOT-23
Manufacturer
ON Semiconductor
Datasheet

Specifications of MMBT4124LT1G

Transistor Type
NPN
Current - Collector (ic) (max)
200mA
Voltage - Collector Emitter Breakdown (max)
25V
Vce Saturation (max) @ Ib, Ic
300mV @ 5mA, 50mA
Dc Current Gain (hfe) (min) @ Ic, Vce
120 @ 2mA, 1V
Power - Max
225mW
Frequency - Transition
300MHz
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Transistor Polarity
NPN
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
25 V
Emitter- Base Voltage Vebo
5 V
Maximum Dc Collector Current
0.2 A
Power Dissipation
225 mW
Maximum Operating Temperature
+ 150 C
Continuous Collector Current
0.2 A
Dc Collector/base Gain Hfe Min
120
Maximum Operating Frequency
300 MHz
Minimum Operating Temperature
- 55 C
Number Of Elements
1
Collector-emitter Voltage
25V
Collector-base Voltage
30V
Emitter-base Voltage
5V
Collector Current (dc) (max)
200mA
Dc Current Gain (min)
120
Frequency (max)
300MHz
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
SOT-23
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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MMBT4124LT1G
General Purpose Transistor
NPN Silicon
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0
2. Alumina = 0.4
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 2
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current − Continuous
Total Device Dissipation
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate (Note 2) @T
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
Compliant
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
FR−5 Board (Note 1) @T
Derate above 25°C
Derate above 25°C
Characteristic
0.75
Rating
0.3
A
= 25°C
0.062 in.
0.024 in. 99.5% alumina.
A
= 25°C
Symbol
Symbol
T
V
V
V
R
R
J
P
P
CEO
CBO
EBO
, T
I
qJA
qJA
C
D
D
stg
−55 to +150
Value
Max
200
225
556
300
417
5.0
1.8
2.4
25
30
1
mW/°C
mW/°C
mAdc
°C/W
°C/W
Unit
Unit
Vdc
Vdc
Vdc
°C
W
W
†For information on tape and reel specifications,
MMBT4124L T1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
(Note: Microdot may be in either location)
Device
ORDERING INFORMATION
MARKING DIAGRAM
ZC = Device Code
M
G
BASE
http://onsemi.com
1
SOT−23 (TO−236)
= Date Code*
= Pb−Free Package
1
(Pb−Free)
CASE 318
Package
SOT−23
STYLE 6
COLLECTOR
ZC M G
EMITTER
2
G
Publication Order Number:
3
2
3
3000 / Tape & Reel
MMBT4124LT1/D
Shipping

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MMBT4124LT1G Summary of contents

Page 1

... MMBT4124LT1G General Purpose Transistor NPN Silicon Features • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Collector−Emitter Voltage Collector−Base Voltage Emitter−Base Voltage Collector Current − Continuous THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR− ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (Note 1.0 mAdc Collector−Base Breakdown Voltage ( mAdc Emitter−Base Breakdown Voltage ( mAdc ...

Page 3

AUDIO SMALL−SIGNAL CHARACTERISTICS 12 SOURCE RESISTANCE = 200 SOURCE RESISTANCE = 200 0 SOURCE RESISTANCE = SOURCE ...

Page 4

0.6 0.4 0.2 0 0.01 0.02 0.03 0.05 0.07 1 25° 1.0 BE(sat) 0.8 0.6 0.4 ...

Page 5

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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