BC848B,235 NXP Semiconductors, BC848B,235 Datasheet
BC848B,235
Specifications of BC848B,235
BC848B /T3
BC848B /T3
Related parts for BC848B,235
BC848B,235 Summary of contents
Page 1
BC848 series 30 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Type number BC848B BC848W 1.2 Features General-purpose ...
Page 2
... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number BC848B BC848W 4. Marking Table 5. Type number BC848B BC848W [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors Pinning Description base ...
Page 3
... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
Page 4
... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage V base-emitter BEsat saturation voltage V base-emitter voltage transition frequency T C collector capacitance noise figure [1] Pulse test: t [2] V decreases by approximately 1.7 mV/K with increasing temperature. ...
Page 5
... NXP Semiconductors 600 h FE (1) 500 400 (2) 300 200 (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. BC848B: DC current gain as a function of collector current; typical values CEsat (mV (1) (3) (2) 10 − 150 °C (1) T amb = 25 °C (2) T amb = − ...
Page 6
... NXP Semiconductors 8. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 5. Package outline SOT23 (TO-236AB) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BC848B BC848W [1] For further information and the availability of packing methods, see ...
Page 7
... NXP Semiconductors 10. Soldering Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x) ...
Page 8
... NXP Semiconductors Fig 9. Reflow soldering footprint SOT323 (SC-70) 3.65 Fig 10. Wave soldering footprint SOT323 (SC-70) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1. 0.60 2.35 0.85 (3×) 1 0.55 (3×) 2.40 4.60 4.00 1. 2.10 1 preferred transport direction during soldering Rev. 07 — ...
Page 9
... NXP Semiconductors 11. Mounting Dimensions in mm PCB thickness: FR4 PCB = 1.6 mm Fig 11. FR4 PCB, standard footprint SOT23 (TO-236AB) BC848_SER_7 Product data sheet 30 V, 100 mA NPN general-purpose transistors 43.4 0.7 0.6 40 0.6 0.7 0.5 006aaa527 Rev. 07 — 17 November 2009 BC848 series 43.4 0.6 ...
Page 10
... Document ID Release date BC848_SER_7 20091117 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 9 “Reflow soldering footprint SOT323 • Figure 10 “Wave soldering footprint SOT323 ...
Page 11
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 12
... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Mounting Revision history ...