BC846,215 NXP Semiconductors, BC846,215 Datasheet - Page 11

• Manufacturer Part Number: BC846,215
• Description: TRANSISTOR NPN 65V 100MA SOT23
• Manufacturer: NXP Semiconductors

Specifications of BC846,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Mounting Type: Surface Mount
• Power - Max: 200mW
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 65V
• Transistor Type: NPN
• Frequency - Transition: 100MHz
• Dc Current Gain (hfe) (min) @ Ic, Vce: 110 @ 2mA, 5V
• Vce Saturation (max) @ Ib, Ic: 400mV @ 5mA, 100mA
• Minimum Operating Temperature: - 65 C
• Configuration: Single
• Transistor Polarity: NPN
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 65 V
• Emitter- Base Voltage Vebo: 6 V
• Maximum Dc Collector Current: 0.1 A
• Power Dissipation: 250 mW
• Maximum Operating Frequency: 100 MHz
• Maximum Operating Temperature: + 150 C
• Number Of Elements: 1
• Collector-emitter Voltage: 65V
• Collector-base Voltage: 80V
• Emitter-base Voltage: 6V
• Collector Current (dc) (max): 100mA
• Dc Current Gain (min): 110
• Frequency (max): 100MHz
• Operating Temp Range: -65C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Package Type: TO-236AB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 933589540215::BC846 T/R::BC846 T/R

NXP Semiconductors
BC846_BC546_SER_7
Product data sheet
Fig 17. Reflow soldering footprint SOT323 (SC-70)
Fig 18. Wave soldering footprint SOT323 (SC-70)
Fig 19. Reflow soldering footprint SOT416 (SC-75)
3.65
2.35
2.10
0.85
Dimensions in mm
preferred transport direction during soldering
Rev. 07 — 17 November 2009
0.60
(3×)
0.55
(3×)
2.0
0.85
0.75
3
3
4.00
1.15
4.60
2.65
1.30
2.40
2
1
(3x)
0.6
65 V, 100 mA NPN general-purpose transistors
1.325
2
1
0.6
solder lands
solder resist
3
0.7
2.2
1.9
2
1
BC846/BC546 series
msa429
1.1
0.50
(3×) 1.90
0.90
(2×)
msa438
2.70
(3x)
0.5
solder paste
occupied area
Dimensions in mm
1.5
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
© NXP B.V. 2009. All rights reserved.
msa419
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