1775204-1 TE Connectivity, 1775204-1 Datasheet - Page 76
![no-image](/images/manufacturer_photos/0/6/654/te_connectivity_sml.jpg)
1775204-1
Manufacturer Part Number
1775204-1
Description
Manufacturer
TE Connectivity
Type
Mini SD Cardr
Datasheet
1.1775204-1.pdf
(116 pages)
Specifications of 1775204-1
Ejector Type
Push-Push
Gender
HDR
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Right Angle
Housing Material
Thermoplastic
Number Of Contact Rows
1
Number Of Contacts
11POS
Voltage Rating Max
10VAC
Current Rating (max)
0.5/ContactA
Contact Material
Phosphor Bronze
Operating Temp Range
-25C to 90C
Product Depth (mm)
19.9mm
Lead Free Status / RoHS Status
Compliant
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LAMFRAME
Key Features
■
■
■
■
■
74
Low cost tape for memory
and microprocessor
applications
Compatible with industry
standard processes
Allow wide range of dielectric
(type and thickness)
Optimisation of dielectric
area for cost reduction
Minimum Slit Size:
0.15 mm
Products for Mobile Equipment
Mechatronic Center Niefern
LAMFRAME
This technology allows Tyco Electronics to
offer a wide range of products for memory
and microprocessor smart cards with:
■
■
■
■
Lamination process is carried out in a clean room to avoid any outside contamination.
Tyco Electronics is able to perform bonding tests with gold or aluminium wires during design phase
but also to ensure the quality during all the life time of the products.
Products are today customer specific, Tyco Electronics Open Design available.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Plating Finishes
●
●
Dielectric
●
●
●
●
Customized thickness
Disconnection option
Gold
“Grey like” plating
Polyimide
Glass epoxy
Polyester
…
Catalog 1654270-2
Revised 8-2007
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