1775204-1 TE Connectivity, 1775204-1 Datasheet - Page 65
![no-image](/images/manufacturer_photos/0/6/654/te_connectivity_sml.jpg)
1775204-1
Manufacturer Part Number
1775204-1
Description
Manufacturer
TE Connectivity
Type
Mini SD Cardr
Datasheet
1.1775204-1.pdf
(116 pages)
Specifications of 1775204-1
Ejector Type
Push-Push
Gender
HDR
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Right Angle
Housing Material
Thermoplastic
Number Of Contact Rows
1
Number Of Contacts
11POS
Voltage Rating Max
10VAC
Current Rating (max)
0.5/ContactA
Contact Material
Phosphor Bronze
Operating Temp Range
-25C to 90C
Product Depth (mm)
19.9mm
Lead Free Status / RoHS Status
Compliant
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MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Products for Mobile Equipment
MID Technology
MID
Two Shot MID Technology
Two Shot
■
■
■
■
Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
■
■
■
■
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
Catalog 1654270-2
Revised 8-2007
63
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