2-1705300-1 TE Connectivity, 2-1705300-1 Datasheet - Page 65

• Manufacturer Part Number: 2-1705300-1
• Description: CONNECTOR, SIM, 2.1MM
• Manufacturer: TE Connectivity
• Type: SIMr

Specifications of 2-1705300-1

• Gender: M
• Mounting Style: Surface Mount
• Termination Method: Solder
• Body Orientation: Straight
• Contact Pitch (mm): 2.54mm
• Housing Material: Thermoplastic
• Number Of Contact Rows: 2
• Number Of Contacts: 6POS
• Contact Material: Copper Alloy
• Connector Type: SIM Socket
• Row Pitch: 7.3mm
• Pitch Spacing: 2.54mm
• No. Of Contacts: 6
• Contact Termination: Surface Mount Vertical
• No. Of Rows: 2
• Contact Plating: Gold Over Nickel
• Rohs Compliant: Yes
• Svhc: No
• Product Type: Connector
• Card Type: 2FF mini SIM
• Card Guide Slots: Without
• Pcb Mount Style: Surface Mount
• Contact Retention: No
• Connector Stabilization Ribs: Without
• Height Above Pc Board (mm [in]): 2.10 [0.083]
• Card Stop: Without
• Ejector Type: Push - Pull
• Centerline (mm [in]): 2.54 [0.100]
• Durability Rating: 5000 Cycles
• Contact Base Material: Selective Gold
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Card Insertion Style: Normal Insertion
• Card Detection Switch: Without
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Products for Mobile Equipment
MID Technology
MID
Two Shot MID Technology
Two Shot
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Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
Catalog 1654270-2
Revised 8-2007
63