AT83C26-RKRUL Atmel, AT83C26-RKRUL Datasheet - Page 65

• Manufacturer Part Number: AT83C26-RKRUL
• Description: RFID Modules & Development Tools 3V Smart card reader
• Manufacturer: Atmel

Electrical Characteristics
Absolute Maximum Ratings
AC/DC Parameters
Table 47. Core (VCC)
7511D–SCR–02/07
Ambient Temperature Under Bias: ....................- 40°C to 85°C
Storage Temperature: ................................... -65°C to +150°C
Voltage on VCC: ........................................ V
Voltage on SCIB pins (***): ......... CVSS -0.5V to CVCC + 0.5V
Voltage on host interface pins:.......VSS -0.5V to EVCC + 0.5V
Voltage on other pins: ...................... VSS -0.5V to VCC + 0.5V
Max Power Dissipation: .............................................. 350mW
Thermal resistor of QFN package (**)......................24° C/W
Thermal resistor of VQFP package...........................67° C/W
I
Hysteresis Delta between (VPFDP - VPFDM)
cc power down
Symbol
I
cc operating
V
V
CLK
PFDM
t
PFDP
t
rise
fall
Power fail high level threshold
Power fail low level threshold
VCC rise time
VCC fall time
Operating current
Power down current
On Chip Oscillator
(**) Exposed die attached pad must be soldered to ground
Thermal resistor is measured on multi-layer PCB with 0 m/s air flow.
(***) including shortages between any groups of smart card pins.
EVCC connected to host power supply: from 2.5V to 5.5V.
T
CLASS A (5V) for smart card 1, 2, 3, 4, 5 supplied with CVCC (+/- 8%)
CLASS B (3V)for smart card 1, 2, 3, 4, 5 supplied with CVCC (+/- 8%)
CLASS C (1.8V) for smart card 1, 2, 3, 4, 5 supplied with CVCC (+/- 8%)
Parameter
A
= -40°C to +85°C; V
*
SS
-0.5V to +6.0V
SS
= 0V; V
100us
Min
2.46
2.26
100
1us
4
CC
= 3V to 5.5V.
*NOTICE:
0.25 * CLK
Typ
2.59
2.40
+12
190
30
Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions above those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Power Dissipation value is based on the maxi-
mum allowable die temperature and the thermal
resistance of the package.
Max
2.75
2.56
300
10s
10s
75
48
Unit
MHz
mV
mA
µA
µs
V
V
DCDCA, DCDCB and
LDOs on
with load= 0 mA
VCC = 5.5V
SHUTDOWNA bit = 1
SHUTDOWNB bit = 1
VCC = 5.5V
AT83C26
Test Conditions
65