29-08-05WB-MG 3M Interconnect Solutions, 29-08-05WB-MG Datasheet - Page 3

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29-08-05WB-MG

Manufacturer Part Number
29-08-05WB-MG
Description
Manufacturer
3M Interconnect Solutions
Type
Micro SD Cardr
Datasheet

Specifications of 29-08-05WB-MG

Ejector Type
Push-Push
Gender
HDR
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Right Angle
Contact Pitch (mm)
1.1mm
Housing Material
Thermoplastic
Number Of Contact Rows
1
Number Of Contacts
8POS
Current Rating (max)
0.5A
Contact Material
Copper Alloy
Operating Temp Range
-25C to 85C
Product Height (mm)
1.85mm
Product Depth (mm)
15.2mm
Product Length (mm)
14mm
Contact Pitch
0.04330708657mm
Lead Free Status / RoHS Status
Compliant
3M™ Card Connector microSD
Normal Polarization, Push-Push, Surfacemount
3
Interconnect Solutions
http://www.3M.com/interconnects/
Ordering Information
2900 Series:
Contact Count = 08
[0.075]
1.90
Ejection Type:
0 = Push-Push
[0.535]
13.60
8X 1.50
[0.059]
PROHIBITION
PATTERN
[0.008]
0.20
2X
29 - XX - X X XX - XX
AREA
[0.055]
[0.016]
1.40
0.40
8X0.80
[0.032]
PCB PATTERN LAYOUT ± 0.05 [0.002]
Card Polarization, Ejection Type, Overall Heght
5 = Normal, Spring-loaded Push Eject, 1.85 mm Height
[0.071]
1.80
RECOMMENDED
#1 #2 #3 #4 #5 #6 #7 #8
[0.508]
12.90
[0.303]
Packing Options:
WB = 24 mm Tape and Reel
7.70
[0.270]
6.85
Plating Suffix:
MG = 15 µ" min. Au on contact
Au Flash on Tail (50 µ" Ni min. underplating) (RoHS* compliant)
[0.071]
[0.043] PITCH
1.80
For technical, sales or ordering information call
[0.045]
[0.049±0.001]
[0.055]
[0.010]
1.15
1.40
0.25
[0.043]
1.24±0.03
1.10
1.10
5X 1.15
[0.045]
[0.024]
0.60
3M is a trademark of 3M Company.
[0.496]
12.60
[0.055]
1.40
[0.075]
1.90
2900 Series
800-225-5373
TS-2197-02
Sheet 3 of 3

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