29-08-05WB-MG 3M Interconnect Solutions, 29-08-05WB-MG Datasheet

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29-08-05WB-MG

Manufacturer Part Number
29-08-05WB-MG
Description
Manufacturer
3M Interconnect Solutions
Type
Micro SD Cardr
Datasheet

Specifications of 29-08-05WB-MG

Ejector Type
Push-Push
Gender
HDR
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Right Angle
Contact Pitch (mm)
1.1mm
Housing Material
Thermoplastic
Number Of Contact Rows
1
Number Of Contacts
8POS
Current Rating (max)
0.5A
Contact Material
Copper Alloy
Operating Temp Range
-25C to 85C
Product Height (mm)
1.85mm
Product Depth (mm)
15.2mm
Product Length (mm)
14mm
Contact Pitch
0.04330708657mm
Lead Free Status / RoHS Status
Compliant
3M™ Card Connector microSD
Normal Polarization, Push-Push, Surfacemount
Physical
Electrical
3
Interconnect Solutions
http://www.3M.com/interconnects/
Environmental
Lock Pin and Link Pin Material: Stainless Steel
*"RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values
chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing,
in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent
Storage Temperature: -40°C to +85°C
Operating Temperature:
Withstanding Voltage:
Insulation Resistance:
Insulation
Contact Material: Copper Alloy
Termination Area: 3 μ″ [ 0.076 μm ] max. Gold flash
Spring Material: Copper Alloy
Cover Material: Stainless Steel
Process Rating: Maximum 250°C, with 40 seconds over 230°C
Current Rating
Flammability: UL 94V-0
Underplating: 50 μ″ [ 1.27 μm ] min. Nickel
Underplating: 40 μ″ [ 1.02 μm ] min. Nickel
Wiping Area: 15 μ″ [ 0.38 μm ] min. Gold
Solder Area: Gold flash
Marking: 3M Logo
Material: High Temperature Thermoplastic
Plating: 30 μ″ [ 0.762 μm ] min. Nickel
Plating
Color: Black
this information represents 3M's knowledge and belief based upon information provided by third party suppliers to 3M.
: 0.5 A
100
500 VAC for one minute
-25°C to +85°C
ΜΩ
min.
• 1.85 mm low profile height
• Small size of 14.0 mm × 14.2 mm footprint
• Smooth push–push eject mechanism
• Card is retained when mated
• Card polarization
• Will accept a card thickness of 0.8 mm
• Mechanism prevents card from flying out upon
• Card detection indicator
• Metal–shielded cover
• microSD™ specification compliant
• RoHS* compliant
ejection
Date Modified: October 31, 2006
For technical, sales or ordering information call
microSD is a trademark of SD Association in Japan.
3M is a trademark of 3M Company.
2900 Series
800-225-5373
TS-2197-02
Sheet 1 of 3

Related parts for 29-08-05WB-MG

29-08-05WB-MG Summary of contents

Page 1

... RoHS* compliant Date Modified: October 31, 2006 : 0.5 A ΜΩ 100 min. 500 VAC for one minute -25°C to +85°C 2900 Series TS-2197-02 Sheet microSD is a trademark of SD Association in Japan trademark of 3M Company. For technical, sales or ordering information call 800-225-5373 ...

Page 2

... REF 14.20 12.90 [0.559] [0.508] 2X 0.60 [0.024] FLAT AREA 1.45 [0.057] 7.15 [0.282] BOTTOM SIDE VIEW For technical, sales or ordering information call 2900 Series (PIN NO. 2) PAD NO. 2 (CARD) CARD INSERTED 0.60 [0.024] FLAT AREA 8X0.35 [0.014] 1.30 [0.051] 8X 0.80 [0.03] REF 13 ...

Page 3

... Card Connector microSD Normal Polarization, Push-Push, Surfacemount 8X 1.50 [0.059] 1.90 [0.075] 13.60 [0.535] 0.20 [0.008] 2X PATTERN PROHIBITION AREA Ordering Information 2900 Series: Contact Count = 08 Ejection Type Push-Push 3 Interconnect Solutions http://www.3M.com/interconnects/ ™ 12.90 [0.508] 7.70 [0.303] 8X0.80 [0.032] 1.40 [0.055 ...

Page 4

Important Notice All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness is not guaranteed. Before using this product, you must evaluate it and determine if it ...

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