TDA9881TS/V2-T NXP Semiconductors, TDA9881TS/V2-T Datasheet - Page 39

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TDA9881TS/V2-T

Manufacturer Part Number
TDA9881TS/V2-T
Description
Modulator / Demodulator IF DEMODULATOR
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA9881TS/V2-T

Package / Case
SSOP-24
Maximum Operating Temperature
+ 70 C
Maximum Power Dissipation
385 mW
Minimum Operating Temperature
- 20 C
Modulation Type
Quadrature
Mounting Style
SMD/SMT
Operating Supply Voltage
5 V
Supply Current
63 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TDA9881TS/V2,518
Philips Semiconductors
9397 750 13417
Product data sheet
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These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 01 — 16 November 2004
Alignment-free vision and FM sound IF PLL demodulator
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
TDA9881
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