TEA6845H/V2-T NXP Semiconductors, TEA6845H/V2-T Datasheet - Page 43

• Manufacturer Part Number: TEA6845H/V2-T
• Description: Tuners VDO-NICE
• Manufacturer: NXP Semiconductors

Specifications of TEA6845H/V2-T

• Pin Count: 64
• Screening Level: Industrial
• Package Type: PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TEA6845H/V2,518

Philips Semiconductors
15.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
16 DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
2001 Apr 12
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
DATA SHEET STATUS
Objective data
Preliminary data
Product data
New In Car Entertainment (NICE) car radio
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
(1)
Development
Qualification
Production
PACKAGE
PRODUCT
STATUS
(2)
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
43
not suitable
not suitable
suitable
not recommended
not recommended
DEFINITIONS
WAVE
TEA6845AH; TEA6845H
(2)
SOLDERING METHOD
(3)(4)
(5)
suitable
suitable
suitable
suitable
suitable
Product specification
REFLOW
(1)