UPC2745TB NEC, UPC2745TB Datasheet

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UPC2745TB

Manufacturer Part Number
UPC2745TB
Description
RF Amplifier 3V Widebnd Amplifier
Manufacturer
NEC
Datasheet

Specifications of UPC2745TB

Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Document No. PU10443EJ01V0DS (1st edition)
(Previous No. P11511EJ3V0DS00)
Date Published November 2003 CP(K)
DESCRIPTION
communications. These low current amplifiers operate on 3.0 V (1.8 V MIN.).
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
FEATURES
• Supply voltage
• Upper limit operating frequency :
• High isolation
• Power gain
• Saturated output power
• High-density surface mounting
APPLICATIONS
• 1.5 GHz to 2.5 GHz communication system :
• 800 MHz to 900 MHz communication system :
ORDERING INFORMATION
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
µ
µ
PC2745TB-E3-A
PC2746TB-E3-A
The
These ICs are manufactured using our 20 GHz f
Remark
Part Number
µ
PC2745TB and
To order evaluation samples, contact your nearby sales office.
Part number for sample order:
WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
6-pin super minimold
µ
PC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile
Package
3 V, SUPER MINIMOLD SILICON MMIC
µ
: Recommended V
:
:
:
: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
Circuit operation V
µ
µ
µ
µ
µ
µ
µ
µ
PC2745TB,
The mark
PC2745TB; f
PC2746TB; f
PC2745TB; ISL = 38 dB TYP.@f = 500 MHz
PC2746TB; ISL = 45 dB TYP.@f = 500 MHz
PC2745TB; G
PC2746TB; G
PC2745TB; P
PC2746TB; P
µ
PC2745TB-A,
µ
BIPOLAR ANALOG INTEGRATED CIRCUIT
Marking
PC2745TB
µ
shows major revised points.
C1Q
C1R
PC2746TB
u
u
O(sat)
O(sat)
P
P
= 2.7 GHz TYP.@3 dB bandwidth
= 1.5 GHz TYP.@3 dB bandwidth
T
= 12 dB TYP.@f = 500 MHz
= 19 dB TYP.@f = 500 MHz
CC
NESATIII silicon bipolar process. This process uses silicon
CC
= −1 dBm TYP.@f = 500 MHz
= 0 dBm TYP.@f = 500 MHz
= 2.7 to 3.3 V
= 1.8 to 3.3 V
µ
• Embossed tape 8 mm wide
• 1, 2, 3 pins face the perforation side of the tape
• Qty 3 kpcs/reel
PC2746TB-A
Supplying Form
µ
©
NEC Compound Semiconductor Devices 1996, 2003
PC2746TB

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UPC2745TB Summary of contents

Page 1

... PC2746TB Marking • Embossed tape 8 mm wide C1Q • pins face the perforation side of the tape C1R • Qty 3 kpcs/reel µ µ PC2745TB-A, PC2746TB-A The mark shows major revised points. µ PC2746TB Supplying Form © NEC Compound Semiconductor Devices 1996, 2003 ...

Page 2

... PIN CONNECTION (Top View µ Marking is an example of PC2745TB PRODUCT LINE- +25° O(sat) Part No. (GHz) (dBm) µ −1.0 PC2745T 2.7 µ PC2745TB µ PC2746T 1.5 0 µ PC2746TB µ −7.0 PC2747T 1.8 µ PC2747TB µ −3.5 PC2748T 0.2 to 1.5 µ PC2748TB µ ...

Page 3

... CC 3 Function and Applications Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. this pin must be coupled to signal source with capacitor for DC cut. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible ...

Page 4

ABSOLUTE MAXIMUM RATINGS Parameter Symbol Supply Voltage V CC Circuit Current I CC Power Dissipation P D Operating Ambient Temperature T A Storage Temperature T stg Input Power P in Note Mounted on double-sided copper-clad 50 × 50 × 1.6 ...

Page 5

STANDARD CHARACTERISTICS FOR REFERENCE (T Parameter Symbol Circuit Current 1 signal CC CC Power Gain 3 1.0 GHz 3 2.0 GHz CC ...

Page 6

... V fluctuation. CC The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. ...

Page 7

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Top View Mounting direction µ (Marking is an example for PC2745TB) COMPONENT LIST Value C 1 000 pF For more information on the use of this IC, refer to the following ...

Page 8

TYPICAL CHARACTERISTICS (T µ ⎯ PC2745TB ⎯ CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal Supply Voltage V NOISE FIGURE, POWER GAIN vs. FREQUENCY 3 ...

Page 9

PC2745TB ⎯ OUTPUT POWER vs. INPUT POWER + 500 MHz –10 – 1 –30 –40 –50 –40 –30 –20 Input Power P (dBm) in OUTPUT ...

Page 10

SMITH CHART (T = +25° 3 µ ⎯ PC2745TB ⎯ S -FREQUENCY 11 S -FREQUENCY 22 µ PC2745TB, Data Sheet PU10443EJ1V0DS µ PC2746TB 10 ...

Page 11

... S-PARAMETERS S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input. Click here to download S-parameters. [RF and Microwave] → [Device Parameters] URL http://www.ncsd.necel.com/ 11 µ PC2745TB, Data Sheet PU10443EJ1V0DS µ ...

Page 12

TYPICAL CHARACTERISTICS (T µ ⎯ PC2746TB ⎯ CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal Supply Voltage V NOISE FIGURE, POWER GAIN vs. FREQUENCY 3 ...

Page 13

PC2746TB ⎯ OUTPUT POWER vs. INPUT POWER + 500 MHz – –20 –30 –40 –50 –40 –30 –20 Input Power P (dBm) in OUTPUT POWER vs. ...

Page 14

SMITH CHART (T = +25° 3 µ ⎯ PC2746TB ⎯ S -FREQUENCY 11 S -FREQUENCY 22 µ PC2745TB, Data Sheet PU10443EJ1V0DS µ PC2746TB 14 ...

Page 15

... S-PARAMETERS S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input. Click here to download S-parameters. [RF and Microwave] → [Device Parameters] URL http://www.ncsd.necel.com/ 15 µ PC2745TB, Data Sheet PU10443EJ1V0DS µ ...

Page 16

PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) µ PC2745TB, 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet PU10443EJ1V0DS µ PC2746TB 16 ...

Page 17

... Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the V (4) The DC cut capacitor must be attached to input pin and output pin. ...

Page 18

... NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • ...

Page 19

... NEC Compound Semiconductor Devices, Ltd. E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) 5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office TEL: +852-3107-7303 Taipei Branch Office ...

Page 20

Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) ...

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