MAX2051ETP+ Maxim Integrated Products, MAX2051ETP+ Datasheet - Page 2

• Manufacturer Part Number: MAX2051ETP+
• Description: RF Mixer SiGe High-Linearity Mixer w/LO Buffer
• Manufacturer: Maxim Integrated Products

Specifications of MAX2051ETP+

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SiGe, High-Linearity, 850MHz to 1550MHz
Up/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V
RF, LO to GND.........................................................-0.3V to 0.3V
IF+, IF-, LOBIAS to GND ............................-0.3V to (V
RF, LO Input Power ........................................................+20dBm
RF, LO Current (RF and LO is DC shorted to GND
Continuous Power Dissipation (Note 1) ........................2100mW
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
ues are at V
RECOMMENDED AC OPERATING CONDITIONS
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
RF Frequency
LO Frequency
IF Frequency
LO Drive Level
CC
Supply Voltage
Supply Current
through balun).................................................................50mA
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
CC
is the temperature on the exposed pad of the package. T
= +5.0V, T
C
= +25°C, unless otherwise noted.)
CC
J
= +4.75V to +5.25V, no input AC signals. T
= T
A
SYMBOL
SYMBOL
+ (θ
V
P
I
f
f
f
CC
RF
LO
J
CC
LO
IF
JA
= T
x V
C
+ (θ
CC
(Notes 5, 6)
(Note 5)
Meeting RF and LO frequency ranges; IF
matching components affect the IF
frequency range (Note 5)
Total supply current
x I
CC
JC
CC
x V
+ 0.3V)
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CC
CONDITIONS
CONDITIONS
). This formula can be used when the temperature of the exposed
A
θ
θ
Operating Case Temperature Range
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
JA
JC
is the ambient temperature of the device and PCB.
(Note 4) ...................................................T
(Notes 2, 3)..............................................................+33°C/W
(Note 3)........................................................................8°C/W
C
= -40°C to +85°C, unless otherwise noted. Typical val-
1200
4.75
MIN
MIN
850
50
-3
TYP
TYP
105
5
C
= -40°C to +85°C
MAX
1550
2250
1000
MAX
5.25
130
+9
UNITS
UNITS
MHz
MHz
MHz
dBm
mA
V