MMBTA63LT1G ON Semiconductor, MMBTA63LT1G Datasheet - Page 2
![TRANS SS DARL PNP 30V SOT23](/photos/1/38/13877/sot-23-3_to-236-3_micro3_ssd3_sst3_sml.jpg)
MMBTA63LT1G
Manufacturer Part Number
MMBTA63LT1G
Description
TRANS SS DARL PNP 30V SOT23
Manufacturer
ON Semiconductor
Datasheet
1.MMBTA63LT1G.pdf
(4 pages)
Specifications of MMBTA63LT1G
Transistor Type
PNP - Darlington
Current - Collector (ic) (max)
500mA
Voltage - Collector Emitter Breakdown (max)
30V
Vce Saturation (max) @ Ib, Ic
1.5V @ 100µA, 100mA
Dc Current Gain (hfe) (min) @ Ic, Vce
10000 @ 100mA, 5V
Power - Max
225mW
Frequency - Transition
125MHz
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Configuration
Single
Transistor Polarity
PNP
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
30 V
Emitter- Base Voltage Vebo
10 V
Collector- Base Voltage Vcbo
30 V
Maximum Dc Collector Current
0.5 A
Maximum Collector Cut-off Current
0.1 uA
Power Dissipation
225 mW
Maximum Operating Temperature
+ 150 C
Continuous Collector Current
- 0.5 A
Dc Collector/base Gain Hfe Min
5000
Minimum Operating Temperature
- 55 C
Rohs Compliant
YES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MMBTA63LT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMBTA63LT1G
Manufacturer:
ON Semiconductor
Quantity:
30 531
Company:
Part Number:
MMBTA63LT1G
Manufacturer:
ON
Quantity:
12 500
Company:
Part Number:
MMBTA63LT1G
Manufacturer:
INF
Quantity:
5 825
Part Number:
MMBTA63LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Product Bulletin #16134
3.
Parts with a smooth bottom surface finish have been attributed with higher failure rates as compared to failure rates
of parts with a matte finish. A matte finish has more surface area for the glue to adhere to as compared to a part
with a smooth surface. As a containment action, ON Semiconductor has placed shipment holds on any inventories
of smooth parts and has notified some customers who have received smooth parts.
We also suspended manufacturing on mold systems that produce smooth parts to have those mold systems
enhanced to produce parts with a matte surface finish. These containment actions have temporarily affected our
capacity but have been resolved and we have returned to full capacity.
The enhanced matte surface is designed to overcome any variability of the mold compound and aids in a
containment action until we can eliminate that variability.
What to do next?
If you have consumed product starting from date code 0814 and have not experienced any component placement
issues on your boards, you should not be affected. Product reliability is not a concern as parts either solder
normally or they don’t.
If you have a manufacturing process that consists of gluing these components to the bottom side of a board in a
wave solder process and have experienced components falling off boards with a greater than normal frequency,
please contact your ON Semiconductor Customer Service Representative or Salesperson to facilitate product
replacement or contact a technical representative to further discuss the issue for containment or other actions.
For technical assistance, please contact:
Asia Pacific/Japan:
Stephen Ng
ON Semiconductor Quality
Phone: +852 26890209
Email:
United States:
Mark Wasilewski
ON Semiconductor Quality
Phone: 602-244-5114
Email:
Europe:
Herve Marchionini
ON Semiconductor Quality,
Phone: +49 89 930 808 36
Email:
Issue Date: 11 Jul 2008
Surface finish of parts
stephen.ng@onsemi.com
m.wasilewski@onsemi.com
herve.marchionini@onsemi.com
Rev.07-02-06
Page 2 of 14