MMBT5401LT1G ON Semiconductor, MMBT5401LT1G Datasheet - Page 3

TRANS SS PNP 150V HV SOT23

MMBT5401LT1G

Manufacturer Part Number
MMBT5401LT1G
Description
TRANS SS PNP 150V HV SOT23
Manufacturer
ON Semiconductor
Type
High Voltager
Datasheets

Specifications of MMBT5401LT1G

Transistor Type
PNP
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
150V
Vce Saturation (max) @ Ib, Ic
500mV @ 5mA, 50mA
Current - Collector Cutoff (max)
50nA
Dc Current Gain (hfe) (min) @ Ic, Vce
60 @ 10mA, 5V
Power - Max
225mW
Frequency - Transition
300MHz
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Configuration
Single
Transistor Polarity
NPN
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
150 V
Emitter- Base Voltage Vebo
5 V
Continuous Collector Current
- 500 mA
Maximum Dc Collector Current
0.5 A
Power Dissipation
225 mW
Maximum Operating Frequency
300 MHz
Maximum Operating Temperature
+ 150 C
Dc Collector/base Gain Hfe Min
50 at 1 mA at 5 V
Minimum Operating Temperature
- 55 C
Current, Collector
-500 mA
Current, Gain
50
Frequency
300 MHz
Package Type
SOT-23
Polarity
PNP
Primary Type
Si
Voltage, Breakdown, Collector To Emitter
-150 V
Voltage, Collector To Base
-160 V
Voltage, Collector To Emitter
-150 V
Voltage, Collector To Emitter, Saturation
-0.5 V
Voltage, Emitter To Base
-5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MMBT5401LT1GOS
MMBT5401LT1GOS
MMBT5401LT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBT5401LT1G
Manufacturer:
ONSEMI
Quantity:
21 000
Part Number:
MMBT5401LT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
MMBT5401LT1G
Manufacturer:
ONSEMI
Quantity:
2 420
Part Number:
MMBT5401LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MMBT5401LT1G
0
Company:
Part Number:
MMBT5401LT1G
Quantity:
300
Company:
Part Number:
MMBT5401LT1G
Quantity:
21 000
V
D
1
G
A
3
L
2
H
B S
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
K
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
SOT−23−3 (TO−236)
MMBT5401LT1
CASE 318−08
J
ISSUE AK
5
SCALE 10:1
0.037
0.95
0.079
inches
NOTES:
2.0
mm
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
STYLE 6:
DIM
G
A
B
C
D
H
K
L
S
V
PIN 1. BASE
J
2. EMITTER
3. COLLECTOR
0.1102
0.0472
0.0350
0.0150
0.0701
0.0005
0.0034
0.0140
0.0350
0.0830
0.0177
MIN
INCHES
0.0551
0.0440
0.0200
0.0807
0.0040
0.0070
0.0285
0.0401
0.1039
0.0236
0.1197
MAX
0.013
0.085
MILLIMETERS
MIN
2.80
1.20
0.89
0.37
1.78
0.35
0.89
2.10
0.45
MAX
0.100
0.177
3.04
1.40
0.50
2.04
0.69
1.02
2.64
0.60
1.11

Related parts for MMBT5401LT1G