L6738ATR STMicroelectronics, L6738ATR Datasheet - Page 10

• Manufacturer Part Number: L6738ATR
• Description: IC PWM CTLR 1PH STPDN 16-VFQFPN
• Manufacturer: STMicroelectronics

Specifications of L6738ATR

• Frequency - Max: 220kHz
• Pwm Type: Voltage Mode
• Number Of Outputs: 1
• Duty Cycle: 100%
• Voltage - Supply: 5 V ~ 12 V
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 32-VFQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-11012-2

Pin description and connection diagrams
Table 2.
2.2
10/32
Pin#
10
11
12
13
14
15
16
8
9
Thermal
Pin description (continued)
Thermal data
Table 3.
COMP
Name
VSEN
OSC
GND
FBG
CSN
CSP
VCC
PAD
FB
Symbol
R
R
T
T
THJC
THJA
MAX
T
STG
J
Error amplifier output.
Connect with an R
Error amplifier inverting input.
Connect with a resistor R
Output voltage monitor.
It manages OVP and UVP protections and PGOOD. Connect to the positive side of the
load for remote sensing. See
Remote ground sense.
Connect to the negative side of the load for remote sensing.
Current sense negative input.
Connect to the output-side of the main inductor. Filter with 100 nF (Typ.) to GND.
Current sense positive input.
Connect through an R-C filter to the phase-side of the main inductor.
OSC: Internally set to 1.24 V, it allows programming the switching frequency F
device. Switching frequency can be increased according to the resistor R
to SGND with a gain of 10 kHz/µA (see
quency is 200 kHz.
Device power supply. The embedded bootstrap diode is internally connected to this pin.
Operative voltage is 5 V to 12 V bus. Filter with 1 µF MLCC to GND.
For proper operations, VCC needs to be >1.5 V higher than the programmed V
All internal references, logic and driver return path are referenced to this pin. Connect to
the PCB GND ground plane and filter to VCC and VCCDR.
The thermal pad connects the silicon substrate and makes good thermal contact with the
PCB. Use VIAs to connect to the PGND plane.
Thermal data
Thermal resistance junction to ambient
(Device soldered on 2s2p PC Board)
Thermal resistance junction to case
Maximum junction temperature
Storage temperature range
Junction temperature range
F
- C
Doc ID 18134 Rev 1
F
to FB. The device cannot be disabled by grounding this pin.
FB
Parameter
to VSEN and with an R
Section 6
for details.
Section 7
Function
for details). If floating, the switching fre-
F
- C
F
to COMP.
-40 to 150
-40 to 125
Value
150
45
1
OSC
connected
SW
OUT
L6738A
of the
°C/W
°C/W
Unit
.
°C
°C
°C