PBLS1501Y,115 NXP Semiconductors, PBLS1501Y,115 Datasheet
PBLS1501Y,115
Specifications of PBLS1501Y,115
PBLS1501Y T/R
PBLS1501Y T/R
Related parts for PBLS1501Y,115
PBLS1501Y,115 Summary of contents
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PBLS1501Y; PBLS1501V 15 V PNP BISS loadswitch Rev. 02 — 24 August 2009 1. Product profile 1.1 General description Low V CEsat Table 1. Type number PBLS1501Y PBLS1501V 1.2 Features I Low V I Low ‘threshold’ voltage ( 1 V) ...
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... NXP Semiconductors Table 2. Symbol R2/R1 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PBLS1501Y PBLS1501V 4. Marking Table 5. Type number PBLS1501Y PBLS1501V [ made in Hong Kong * = t: made in Malaysia * = W: made in China PBLS1501Y_PBLS1501V_2 Product data sheet PBLS1501Y; PBLS1501V Quick reference data …continued Parameter Conditions ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Transistor TR1: PNP V CBO V CEO V EBO tot Transistor TR2: NPN V CBO V CEO V EBO tot Per device P tot T stg amb [1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 7. Characteristics Table 8. Characteristics unless otherwise specified amb Symbol Parameter Transistor TR1: PNP I collector-base cut-off CBO current I collector-emitter CES cut-off current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R equivalent CEsat on-resistance V base-emitter BEsat saturation voltage ...
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... NXP Semiconductors 600 h FE (1) 400 (2) 200 ( (1) T 150 C amb ( amb ( amb Fig 1. TR1(PNP): DC current gain as a function of collector current; typical values 1100 V BE (mV) 900 (1) 700 (2) 500 (3) 300 100 ( amb ( amb (3) T 150 C amb Fig 3. TR1(PNP): Base-emitter voltage as a function of collector current; typical values ...
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... NXP Semiconductors 1200 ( (2) (mA) (3) (4) 800 400 amb ( ( ( ( ( ( ( ( ( (10 Fig 5. TR1(PNP): Collector current as a function of collector-emitter voltage; typical values PBLS1501Y_PBLS1501V_2 Product data sheet PBLS1501Y; PBLS1501V 001aaa182 R CEsat ...
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... NXP Semiconductors 1 V CEsat ( ( amb ( 100 Fig 7. TR1(PNP): Collector-emitter saturation voltage as a function of collector current; typical values PBLS1501Y_PBLS1501V_2 Product data sheet PBLS1501Y; PBLS1501V 006aaa004 CEsat ( ) (mA amb ( ( ( Fig 8. TR1(PNP): Equivalent on-resistance as a function of collector current; typical values Rev. 02 — 24 August 2009 ...
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... NXP Semiconductors (1) T 150 C amb ( amb ( amb Fig 9. TR2(NPN): DC current gain as a function of collector current; typical values I(on) (V) 10 (1) ( amb ( amb (3) T 100 C amb Fig 11. TR2(NPN): On-state input voltage as a function of collector current; typical values PBLS1501Y_PBLS1501V_2 Product data sheet PBLS1501Y ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 13. Package outline SOT363 (SC-88) PBLS1501Y_PBLS1501V_2 Product data sheet PBLS1501Y; PBLS1501V scale ...
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... NXP Semiconductors Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions) UNIT 0.6 0.27 0.18 1.7 mm 0.5 0.17 0.08 1.5 OUTLINE VERSION IEC SOT666 Fig 14. Package outline SOT666 PBLS1501Y_PBLS1501V_2 Product data sheet PBLS1501Y; PBLS1501V scale 1.3 1.7 0.3 1.0 ...
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... NXP Semiconductors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBLS1501Y SOT363 PBLS1501V SOT666 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... Product data sheet PBLS1501Y; PBLS1501V Data sheet status Product data sheet This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Table 3 “Discrete pinning”: amended Figure 13 “ ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Legal information ...