PUMB30,115 NXP Semiconductors, PUMB30,115 Datasheet - Page 6

• Manufacturer Part Number: PUMB30,115
• Description: TRANS PNP/PNP W/RES 50V SOT-363
• Manufacturer: NXP Semiconductors

Specifications of PUMB30,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Transistor Type: 2 PNP - Pre-Biased (Dual)
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 50V
• Resistor - Base (r1) (ohms): 2.2K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 30 @ 20mA, 5V
• Vce Saturation (max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (max): 1µA
• Power - Max: 300mW
• Mounting Type: Surface Mount
• Configuration: Dual
• Transistor Polarity: PNP
• Typical Input Resistor: 2.2 KOhm
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 50 V
• Peak Dc Collector Current: 100 mA
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Frequency - Transition: -
• Resistor - Emitter Base (r2) (ohms): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934059933115; PUMB30 T/R; PUMB30 T/R

NXP Semiconductors
10. Soldering
PEMB30_PUMB30_2
Product data sheet
Fig 5.
Fig 6.
4.5
2.35
Dimensions in mm
Reflow soldering footprint SOT363 (SC-88)
Wave soldering footprint SOT363 (SC-88)
1.5
PNP/PNP double resistor-equipped transistors; R1 = 2.2 k , R2 = open
1.3
(4 )
0.6
(4 )
0.5
Rev. 02 — 2 September 2009
2.45
5.3
(4 )
(4 )
0.5
0.6
1.3
2.65
1.8
(2 )
0.6
1.5
1.5
0.4 (2 )
0.3
PEMB30; PUMB30
2.5
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
solder lands
solder resist
solder paste
occupied area
preferred transport
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
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