LFE3-150EA-7FN672C LATTICE SEMICONDUCTOR, LFE3-150EA-7FN672C Datasheet - Page 44
LFE3-150EA-7FN672C
Manufacturer Part Number
LFE3-150EA-7FN672C
Description
FPGA LatticeECP3™ Family 149000 Cells 65nm Technology 1.2V 672-Pin FBGA
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet
1.LFE3-150EA-7FN672C.pdf
(136 pages)
Specifications of LFE3-150EA-7FN672C
Package
672FBGA
Family Name
LatticeECP3Â
Device Logic Units
149000
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
380
Ram Bits
7014400
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Lattice Semiconductor
Figure 2-38. LatticeECP3 Banks
LatticeECP3 devices contain two types of sysI/O buffer pairs.
1. Top (Bank 0 and Bank 1) and Bottom sysIO Buffer Pairs (Single-Ended Outputs Only)
The sysI/O buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of
single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be con-
figured as a differential input. Only the top edge buffers have a programmable PCI clamp.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
The top and bottom sides are ideal for ADDR/CMD signals of DDR3, general purpose I/O, PCI, TR-LVDS (tran-
sition reduced LVDS) or LVDS inputs.
The I/O pins located on the top and bottom sides of the device are fully hot socketable.
V REF1(7)
V REF2(7)
V
V REF1(6)
V REF2(6)
V CCIO6
CCIO7
GND
GND
Bank 0
BOTTOM
SERDES
TOP
Quads
2-41
Bank 1
LatticeECP3 Family Data Sheet
V REF1(2)
V REF2(2)
V CCIO2
GND
V REF1(3)
V REF2(3)
V CCIO3
GND
Architecture
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