XC2VP7-5FG456I Xilinx Inc, XC2VP7-5FG456I Datasheet - Page 9
![no-image](/images/no-image-200.jpg)
XC2VP7-5FG456I
Manufacturer Part Number
XC2VP7-5FG456I
Description
FPGA Virtex-II Pro™ Family 11088 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 456-Pin FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet
1.XC2VP20-5FGG676C.pdf
(430 pages)
Specifications of XC2VP7-5FG456I
Package
456FBGA
Family Name
Virtex-II ProÂ
Device Logic Units
11088
Number Of Registers
9856
Maximum Internal Frequency
1050 MHz
Typical Operating Supply Voltage
1.5 V
Maximum Number Of User I/os
248
Ram Bits
811008
Number Of Logic Elements/cells
11088
Number Of Labs/clbs
1232
Total Ram Bits
811008
Number Of I /o
248
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
456-BBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC2VP7-5FG456I
Manufacturer:
RFMD
Quantity:
1 560
Company:
Part Number:
XC2VP7-5FG456I
Manufacturer:
XilinxInc
Quantity:
3 000
Part Number:
XC2VP7-5FG456I
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
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Virtex-II Pro Ordering Examples
Virtex-II Pro ordering examples are shown in
Virtex-II Pro X Ordering Example
A Virtex-II Pro X ordering example is shown in
DS083 (v4.7) November 5, 2007
Product Specification
R
Example: XC2VPX20 -6 FF 896 C
Speed Grade
Example: XC2VP40 -6 FG G 676 I
Speed Grade
Example: XC2VP40 -7 FF 1152 C
Speed Grade
Device Type
(-5, -6, -7*)
Device Type
(-5, -6, -7*)
Device Type
*NOTE: -7 devices not available in Industrial grade.
*NOTE: -7 devices not available in Industrial grade.
(-5, -6)
Figure 2: Virtex-II Pro Ordering Example, Pb-Free Wire-Bond Package
Figure 3: Virtex-II Pro X Ordering Example, Flip-Chip Package
Figure 1: Virtex-II Pro Ordering Example, Flip-Chip Package
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Introduction and Overview
Figure 1
Figure
www.xilinx.com
3.
(flip-chip package) and
Temperature Range:
Number of Pins
Package Type
Temperature Range:
Number of Pins
Package Type
Pb-Free
Package Type
Temperature Range:
Number of Pins
C = Commercial (Tj = 0˚C to +85˚C)
I = Industrial* (Tj = –40˚C to +100˚C)
C = Commercial (Tj = 0°C to +85°C)
I = Industrial* (Tj = –40°C to +100°C)
C = Commercial (Tj = 0˚C to +85˚C)
I = Industrial* (Tj = –40˚C to +100˚C)
Figure 2
(Pb-free wire-bond package).
DS083-1_02b_062104
DS083_02a_092705
DS083_02_062104
Module 1 of 4
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