PKB4418PINB Ericsson Power Modules, PKB4418PINB Datasheet - Page 44

• Manufacturer Part Number: PKB4418PINB
• Description: Module DC-DC 1-OUT 1.8V 25A 45W 8-Pin 1/8-Brick
• Manufacturer: Ericsson Power Modules
• Type: Step Downr

Specifications of PKB4418PINB

• Package: 81/8-Brick
• Output Current: 25 A
• Output Voltage: 1.8 V
• Input Voltage: 36 to 75 V
• Number Of Outputs: 1
• Output Power: 45 W

Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection or vapor phase reflow SnPb and Pb-free
processes. To achieve a good and reliable soldering result,
make sure to follow the recommendations from the solder
paste supplier, to use state-of-the-art reflow equipment and
reflow profiling techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendations since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
of the solder melting temperature, (T
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Prepared (also subject responsible if other)
EPANHON
Approved
SEC/D [Julia You]
PKB 4000 series
DC/DC converters, Input 36-75 V, Output 30 A/90 W
Pin 2 for measurement of maximum
peak product reflow temperature, T
Pin 4 for measurement of minimum
solder joint temperature, T
L
, +183°C for Sn63/Pb37)
PIN
P
L
, +217 to +221°C
Checked
See §1
PIN
PIN
) in excess
) in
PROD. SPECIFICATION MECHANICAL
No.
5/1301-BMR 636 Uen
Date
2007-10-15
Peak Product Temperature Requirements
Pin number 2 is chosen as reference location for the
maximum (peak) allowed product temperature (T
will likely be the warmest part of the product during the reflow
process.
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. A sufficiently extended preheat time is recommended
to ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow, T
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
25 °C
Reflow process specifications
Average ramp-up rate
Solder melting
temperature (typical)
Minimum time above T
Minimum pin temperature
Peak product temperature T
Average ramp-down rate
Time 25°C to peak
Temperature
T
T
P
L
P
P
must not exceed +225°C at any time.
must not exceed +260°C at any time.
L
Technical Specifi cation
EN/LZT 146 394 R5A August 2009
© Ericsson AB
Rev
B
Time 25 °C to peak
T
T
Preheat
L
PIN
P
Sn/Pb eutectic
3°C/s max
+183°C
30 s
+210°C
+225°C
6°C/s max
6 minutes max
Ramp-up
Reference
Reflow
Pb-free
3°C/s max
+221°C
30 s
+235°C
+260°C
6°C/s max
8 minutes max
P
Ramp-down
(cooling)
) since this
Time
1 (4)
44