SI8235AB-C-IM Silicon Laboratories Inc, SI8235AB-C-IM Datasheet - Page 42

• Manufacturer Part Number: SI8235AB-C-IM
• Description: MOSFET DRVR 4A 2-OUT Half Brdg Non-Inv 14-Pin LGA
• Manufacturer: Silicon Laboratories Inc

Specifications of SI8235AB-C-IM

• Package: 14LGA
• Driver Configuration: Non-Inverting
• Peak Output Current: 4 A
• Input Logic Compatibility: TTL
• Number Of Outputs: 2
• Output Resistance: 2.7 Ohm
• Maximum Rise Time: 20 ns
• Maximum Power Dissipation: 1200 mW
• Maximum Supply Current: 2.5(Typ) mA
• Operating Temperature: -40 to 125 °C
• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 60ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Voltage - Supply: 6.5 V ~ 24 V
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Si823x
11. Package Outline: 16-Pin Narrow Body SOIC
Figure 47 illustrates the package details for the Si823x in a 16-pin narrow-body SOIC (SO-16). Table 20 lists the
values for the dimensions shown in the illustration.
42
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MS-012, Variation AC.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body
A1
A2
E1
Components.
A
D
E
b
c
e
Figure 47. 16-pin Small Outline Integrated Circuit (SOIC) Package
0.10
1.25
0.31
0.17
Min
—
9.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
Table 20. Package Diagram Dimensions
Max
1.75
0.25
0.51
0.25
—
Rev. 1.0
Dimension
aaa
bbb
ddd
ccc
L2
L
h
θ
0.40
0.25
Min
0°
0.25 BSC
0.10
0.20
0.10
0.25
Max
1.27
0.50
8°