MT48LC4M16A2TG-7E:G Micron Technology Inc, MT48LC4M16A2TG-7E:G Datasheet - Page 56

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MT48LC4M16A2TG-7E:G

Manufacturer Part Number
MT48LC4M16A2TG-7E:G
Description
DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M16A2TG-7E:G

Density
64 Mb
Maximum Clock Rate
143 MHz
Package
54TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
5.4 ns
Operating Temperature
0 to 70 °C
Organization
4Mx16
Address Bus
14b
Access Time (max)
5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M16A2TG-7E:G
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 39:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
DQML, DQMH
Self Refresh Mode
COMMAND
A0–A9, A11
BA0, BA1
DQM/
Notes:
CKE
A10
CLK
DQ
High-Z
Precharge all
t CKS
active banks
t CMS
SINGLE BANK
t
AS
PRECHARGE
ALL BANKS
BANK(S)
T0
1. No maximum time limit for self refresh mode.
2.
3. Self refresh mode not supported on automotive temperature (AT) devices.
t CKH
t CMH
t
AH
t CK
t
XSR requires minimum of two clocks regardless of frequency and timing.
t RP
T1
NOP
t CH
Enter self refresh mode
t CKS
t CL
REFRESH
AUTO
CLK stable prior to exiting
T2
self refresh mode
t RAS(MIN)
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1
(Restart refresh time base)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Exit self refresh mode
Tn + 1
NOP
t XSR
t
RAS(MAX) applies to non-self refresh mode.
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or COMMAND
INHIBIT
To + 1
64Mb: x4, x8, x16 SDRAM
©2000 Micron Technology, Inc. All rights reserved.
To + 2
REFRESH
AUTO
Timing Diagrams
DON’T CARE

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