MT48LC4M16A2TG-7E:G Micron Technology Inc, MT48LC4M16A2TG-7E:G Datasheet - Page 34

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MT48LC4M16A2TG-7E:G

Manufacturer Part Number
MT48LC4M16A2TG-7E:G
Description
DRAM Chip SDRAM 64M-Bit 4Mx16 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M16A2TG-7E:G

Density
64 Mb
Maximum Clock Rate
143 MHz
Package
54TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
5.4 ns
Operating Temperature
0 to 70 °C
Organization
4Mx16
Address Bus
14b
Access Time (max)
5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M16A2TG-7E:G
Manufacturer:
MICRON/美光
Quantity:
20 000
Power-Down
Figure 24:
Figure 25:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
Terminating a WRITE Burst
PRECHARGE Command
Note:
Power-down occurs if CKE is registered LOW coincident with a NOP or COMMAND
INHIBIT when no accesses are in progress. If power-down occurs when all banks are
idle, this mode is referred to as precharge power-down; if power-down occurs when
there is a row active in any bank, this mode is referred to as active power-down. Entering
power-down deactivates the input and output buffers, excluding CKE, for maximum
power savings while in standby. The device may not remain in the power-down state
longer than the refresh period (
performed in this mode.
The power-down state is exited by registering a NOP or COMMAND INHIBIT and CKE
HIGH at the desired clock edge (meeting
COMMAND
A0–A9
BA0,1
RAS#
CAS#
ADDRESS
WE#
CKE
CLK
A10
CS#
DQMs are LOW.
CLK
TRANSITIONING DATA
DQ
HIGH
VALID ADDRESS
BANK,
WRITE
COL n
D
T0
n
IN
TERMINATE
Bank Selected
BURST
T1
All Banks
ADDRESS
BANK
DON’T CARE
COMMAND
(ADDRESS)
(DATA)
NEXT
T2
34
DON’T CARE
t
REF or
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
REF
t
CKS). See Figure 26 on page 35.
AT
) since no refresh operations are
64Mb: x4, x8, x16 SDRAM
©2000 Micron Technology, Inc. All rights reserved.
Commands

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